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Metallurgical and Materials Transactions B
Published in: Metallurgical and Materials Transactions B 2/2013

01-04-2013

Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology

Authors: Torleif André Tollefsen, Andreas Larsson, Maaike Margrete Visser Taklo, Antonia Neels, Xavier Maeder, Kristin Høydalsvik, Dag W. Breiby, Knut Aasmundtveit

Published in: Metallurgical and Materials Transactions B | Issue 2/2013

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Abstract

Au-Sn solid–liquid interdiffusion (SLID) bonding is an established reliable high temperature (HT) die attach and interconnect technology. This article presents the life cycle of an optimized HT Au-Sn SLID bond, from fabrication, via thermal treatment, to mechanical rupture. The layered structure of a strong and uniform virgin bond was identified by X-ray diffraction to be Au/ζ (Au0.85Sn0.15)/Au. During HT exposure, it was transformed to Au/β (Au1.8Sn0.2)/Au. After HT exposure, the die shear strength was reduced by 50 pct, from 14 Pa to 70 MPa, which is still remarkably high. Fractographic studies revealed a change in fracture mode; it was changed from a combination of adhesive Au/Ni and cohesive SiC fracture to a cohesive β-phase fracture. Design rules for high quality Au-Sn SLID bonds are given.
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Metadata
Title
Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology
Authors
Torleif André Tollefsen
Andreas Larsson
Maaike Margrete Visser Taklo
Antonia Neels
Xavier Maeder
Kristin Høydalsvik
Dag W. Breiby
Knut Aasmundtveit
Publication date
01-04-2013
Publisher
Springer US
Published in
Metallurgical and Materials Transactions B / Issue 2/2013
Print ISSN: 1073-5615
Electronic ISSN: 1543-1916
DOI
https://doi.org/10.1007/s11663-012-9789-1

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