Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 6/2013

01-06-2013

Ba(Zn1/3Ta2/3)O3 ceramics reinforced high density polyethylene for microwave applications

Authors: K. M. Manu, S. Soni, V. R. K. Murthy, M. T. Sebastian

Published in: Journal of Materials Science: Materials in Electronics | Issue 6/2013

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The effect of Ba(Zn1/3Ta2/3)O3 (BZT) ceramic filler on the dielectric, mechanical and thermal properties of high density polyethylene (HDPE) matrix have been investigated. The dispersion of BZT particles in the matrix was varied up to 0.45 volume fraction (Vf). The SEM images confirmed the increase in connectivity between the filler particles with the increase in filler loading. All the composites showed excellent densification (>99 %) with relatively low moisture absorption (<0.04 wt%). The dielectric properties of the composites were investigated at 1 MHz, 5 GHz and at 10 GHz. The relative permittivity and the dielectric loss were found to increase as a function of BZT loading. Different theoretical models were used to predict the relative permittivity at 10 GHz. Effective medium theory gave the best correlation with the experimental results. An enhancement in the thermal conductivity (TC) and a reduction in the coefficient of linear thermal expansion (CTE) were achieved with filler loading. A slight decrease in the tensile strength was also observed with BZT loading. At 10 GHz, 0.45 Vf BZT reinforced HDPE showed a low relative permittivity (εr = 8.2) and a low dielectric loss (tanδ = 1.6 × 10−3) with good thermal (TC = 1.4 W m−1 K−1, CTE = 92 ppm/°C) and mechanical (tensile strength = 18 MPa) properties.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
1.
go back to reference K. Maexa, M.R. Baklanov, D. Shamiryan, F. Iacopi, S.H. Brongersma, Z.S. Yanovitskaya, J. Appl. Phys. 93, 8793 (2003)CrossRef K. Maexa, M.R. Baklanov, D. Shamiryan, F. Iacopi, S.H. Brongersma, Z.S. Yanovitskaya, J. Appl. Phys. 93, 8793 (2003)CrossRef
2.
go back to reference M.B. Tian, Substrates for High Density Package Engineering (Tsinghua University Press, Beijing, 2003) M.B. Tian, Substrates for High Density Package Engineering (Tsinghua University Press, Beijing, 2003)
3.
go back to reference D.D.L. Chung, Materials for Electronic Packaging (Butterworth, Heinemann, Boston, 1995) D.D.L. Chung, Materials for Electronic Packaging (Butterworth, Heinemann, Boston, 1995)
4.
go back to reference M.T. Sebastian, Dielectric Materials for Wireless Communication (Elseiver Publishers, Oxford, U. K., 2008) M.T. Sebastian, Dielectric Materials for Wireless Communication (Elseiver Publishers, Oxford, U. K., 2008)
5.
go back to reference M.T. Sebastian, H. Jantunen, Int. J. Appl. Ceram. Technol. 7, 415 (2010) M.T. Sebastian, H. Jantunen, Int. J. Appl. Ceram. Technol. 7, 415 (2010)
6.
go back to reference H. Ohsato, T. Tsunooka, T. Sugiyama, K. Kakimoto, H. Ogawa, J. Electroceram. 17, 445 (2006)CrossRef H. Ohsato, T. Tsunooka, T. Sugiyama, K. Kakimoto, H. Ogawa, J. Electroceram. 17, 445 (2006)CrossRef
7.
go back to reference K. P. Surendran, M. T. Sebastian, M. V. Manjusha, J. Philip, J. Appl. Phys. 98, 044101 (2005) K. P. Surendran, M. T. Sebastian, M. V. Manjusha, J. Philip, J. Appl. Phys. 98, 044101 (2005)
9.
10.
11.
13.
go back to reference P.S. Anjana, S. Uma, J. Philip, M.T. Sebastian, J. Appl. Poly. Sci. 118, 751 (2010) P.S. Anjana, S. Uma, J. Philip, M.T. Sebastian, J. Appl. Poly. Sci. 118, 751 (2010)
14.
go back to reference D.P. Button, B.A. Yost, R.H. French, W.Y. Hsu, J.D. Belt, M.A. Subrahmanian, H.-M. Zhang, R.E. Geidd, A.J. Whittacker, D.G. Onn, Ceramic-Fiber/Polymer Laminates: Thermally Conductive Composites with Low Dielectric Constants, vol. 26 (American Ceramic Society, Westerville, OH, 1989), p. 353 D.P. Button, B.A. Yost, R.H. French, W.Y. Hsu, J.D. Belt, M.A. Subrahmanian, H.-M. Zhang, R.E. Geidd, A.J. Whittacker, D.G. Onn, Ceramic-Fiber/Polymer Laminates: Thermally Conductive Composites with Low Dielectric Constants, vol. 26 (American Ceramic Society, Westerville, OH, 1989), p. 353
15.
go back to reference S. Rajesh, K.P. Murali, K.V. Rajani, R. Ratheesh, Int. J. Appl. Ceram. Technol. 6, 553 (2009)CrossRef S. Rajesh, K.P. Murali, K.V. Rajani, R. Ratheesh, Int. J. Appl. Ceram. Technol. 6, 553 (2009)CrossRef
16.
go back to reference D. Thomas, C. Janardhanan, M.T. Sebastian, Int. J. Appl. Ceram. Technol. 8, 1099 (2011)CrossRef D. Thomas, C. Janardhanan, M.T. Sebastian, Int. J. Appl. Ceram. Technol. 8, 1099 (2011)CrossRef
17.
go back to reference G. Subodh, C. Pavithran, P. Mohanan, M.T. Sebastian, J. Eur. Ceram. Soc. 27, 3039 (2007)CrossRef G. Subodh, C. Pavithran, P. Mohanan, M.T. Sebastian, J. Eur. Ceram. Soc. 27, 3039 (2007)CrossRef
18.
go back to reference S. George, V.N. Deepu, P. Mohanan, M.T. Sebastian, Poly. Eng. Sci. 50, 570 (2010)CrossRef S. George, V.N. Deepu, P. Mohanan, M.T. Sebastian, Poly. Eng. Sci. 50, 570 (2010)CrossRef
19.
go back to reference S. Rajesh, K.P. Murali, H. Jantunen, R. Ratheesh, Physica B: Condens. Matter 406, 4312 (2011)CrossRef S. Rajesh, K.P. Murali, H. Jantunen, R. Ratheesh, Physica B: Condens. Matter 406, 4312 (2011)CrossRef
21.
go back to reference P.S. Anjana, V. Deepu, S. Uma, P. Mohanan, J. Philip, M.T. Sebastian, J. Poly. Sci. Part B: Poly. Phys. 48, 998 (2010)CrossRef P.S. Anjana, V. Deepu, S. Uma, P. Mohanan, J. Philip, M.T. Sebastian, J. Poly. Sci. Part B: Poly. Phys. 48, 998 (2010)CrossRef
22.
go back to reference S. Thomas, V. Deepu, S. Uma, P. Mohanan, J. Philip, M. T. Sebastian, Mater. Sci. Eng. B-Adv. Funct. Solid-State Mater. 163, 67 (2009) S. Thomas, V. Deepu, S. Uma, P. Mohanan, J. Philip, M. T. Sebastian, Mater. Sci. Eng. B-Adv. Funct. Solid-State Mater. 163, 67 (2009)
23.
go back to reference G. Subodh, V. Deepu, P. Mohanan, M.T. Sebastian, J. Phys. D 42, 225501 (2009)CrossRef G. Subodh, V. Deepu, P. Mohanan, M.T. Sebastian, J. Phys. D 42, 225501 (2009)CrossRef
24.
go back to reference S. George, P.S. Anjana, J. Krupka, S. Uma, J. Philip, M.T. Sebastian, Int. J. Appl. Ceram. Technol. 7, 461 (2010) S. George, P.S. Anjana, J. Krupka, S. Uma, J. Philip, M.T. Sebastian, Int. J. Appl. Ceram. Technol. 7, 461 (2010)
25.
go back to reference T. Joseph, S. Uma, J. Philip, M.T. Sebastian, J. Mater. Sci: Mater. Electron. 23, 1243 (2012)CrossRef T. Joseph, S. Uma, J. Philip, M.T. Sebastian, J. Mater. Sci: Mater. Electron. 23, 1243 (2012)CrossRef
26.
go back to reference S. Kawashima, M. Nishida, I. Ueda, H. Ouchi, J. Am. Ceram. Soc. 66, 421 (1983)CrossRef S. Kawashima, M. Nishida, I. Ueda, H. Ouchi, J. Am. Ceram. Soc. 66, 421 (1983)CrossRef
27.
go back to reference J. Krupka, R. G. Geyer, J. B. Jarvis, J. Ceremuga, Seventh Intl. Conference on Dielectric Materials, Measurements and Applications, Conf.Publ. No. 430, 21 (1996) J. Krupka, R. G. Geyer, J. B. Jarvis, J. Ceremuga, Seventh Intl. Conference on Dielectric Materials, Measurements and Applications, Conf.Publ. No. 430, 21 (1996)
29.
go back to reference W.J. Parker, R.J. Jenkins, C.P. Butler, G.L. Abbot, J. Appl. Phys. 9, 1679 (1961)CrossRef W.J. Parker, R.J. Jenkins, C.P. Butler, G.L. Abbot, J. Appl. Phys. 9, 1679 (1961)CrossRef
30.
go back to reference S.J. Penn, N.M. Alford, A. Templeton, X.R. Wang, M.S. Xu, M. Reece, K. Schrapel, J. Am. Ceram. Soc. 80, 1885 (1997)CrossRef S.J. Penn, N.M. Alford, A. Templeton, X.R. Wang, M.S. Xu, M. Reece, K. Schrapel, J. Am. Ceram. Soc. 80, 1885 (1997)CrossRef
31.
go back to reference P. Gonon, T.P. Hong, O. Lesaint, S. Bourdelais, H. Debruyne, Polym. Testing 24, 799 (2005)CrossRef P. Gonon, T.P. Hong, O. Lesaint, S. Bourdelais, H. Debruyne, Polym. Testing 24, 799 (2005)CrossRef
32.
go back to reference T.S. Laverghetta, Microwave Materials and Fabrication Techniques (Artech House, USA, 1984) T.S. Laverghetta, Microwave Materials and Fabrication Techniques (Artech House, USA, 1984)
33.
go back to reference K.P. Murali, S. Rajesh, O. Prakash, A.R. Kulkarni, R. Ratheesh, Compos. Part A 40, 1179 (2009)CrossRef K.P. Murali, S. Rajesh, O. Prakash, A.R. Kulkarni, R. Ratheesh, Compos. Part A 40, 1179 (2009)CrossRef
34.
go back to reference D.H. Kuo, C.C. Chang, T.Y. Su, W.K. Wang, B.Y. Lin, Mater. Chem. Phys. 85, 201 (2004)CrossRef D.H. Kuo, C.C. Chang, T.Y. Su, W.K. Wang, B.Y. Lin, Mater. Chem. Phys. 85, 201 (2004)CrossRef
36.
go back to reference K. Wakino, T. Okada, N. Yoshida, K. Tomono, J. Am. Ceram. Soc. 76, 2588 (1993)CrossRef K. Wakino, T. Okada, N. Yoshida, K. Tomono, J. Am. Ceram. Soc. 76, 2588 (1993)CrossRef
37.
go back to reference K.P. Murali, S. Rajesh, O. Prakash, A.R. Kulkarni, R. Ratheesh, Mater. Chem. Phys. 113, 290 (2009)CrossRef K.P. Murali, S. Rajesh, O. Prakash, A.R. Kulkarni, R. Ratheesh, Mater. Chem. Phys. 113, 290 (2009)CrossRef
38.
go back to reference Y. Rao, J.M. Qu, T. Marinis, C.P. Wong, IEEE Trans. Comp. Packag. Technol. 23, 680 (2000)CrossRef Y. Rao, J.M. Qu, T. Marinis, C.P. Wong, IEEE Trans. Comp. Packag. Technol. 23, 680 (2000)CrossRef
39.
go back to reference B. Riddle, J.B. Jarvis, J. Krupka, IEEE Trans. Microw. Theory Tech. 51, 727 (2003)CrossRef B. Riddle, J.B. Jarvis, J. Krupka, IEEE Trans. Microw. Theory Tech. 51, 727 (2003)CrossRef
40.
42.
43.
go back to reference W.D. Kingery, Introduction to Ceramics (Wiley, New York, 1960) W.D. Kingery, Introduction to Ceramics (Wiley, New York, 1960)
Metadata
Title
Ba(Zn1/3Ta2/3)O3 ceramics reinforced high density polyethylene for microwave applications
Authors
K. M. Manu
S. Soni
V. R. K. Murthy
M. T. Sebastian
Publication date
01-06-2013
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 6/2013
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-013-1064-y

Other articles of this Issue 6/2013

Journal of Materials Science: Materials in Electronics 6/2013 Go to the issue