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Published in:

01-09-2023

Complex Thermoanalytical Studies of K-800 Organosilicon Adhesive

Authors: Yu. M. Kozhevnikova, I. G. Tolmacheva, V. N. Borisov, O. N. Zaikovskaya, R. R. Iskhuzhin, A. F. Agafonova, I. A. Belobrova

Published in: Polymer Science, Series D | Issue 3/2023

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Abstract

This paper presents the results of a complex thermoanalytical study of K-800 organosilicon adhesive. The temperatures of curing of the adhesive composition, evaporation of the reaction products, and the onset of thermal degradation have been determined. Correlation and comparison of research results obtained by different methods has been carried out. It is shown that the results of complex thermal analytical studies can be used as the basis for assessing the quality of the adhesive joint.

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Title: Complex Thermoanalytical Studies of K-800 Organosilicon Adhesive
Authors: Yu. M. Kozhevnikova
I. G. Tolmacheva
V. N. Borisov
O. N. Zaikovskaya
R. R. Iskhuzhin
A. F. Agafonova
I. A. Belobrova
Publication date: 01-09-2023
Publisher: Pleiades Publishing
Published in: Polymer Science, Series D / Issue 3/2023
Print ISSN: 1995-4212
Electronic ISSN: 1995-4220
DOI: https://doi.org/10.1134/S1995421223030164

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