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Engineering with Computers
Published in: Engineering with Computers 3/2017

21-11-2016 | Original Article

Component-based workflows for parallel thermomechanical analysis of arrayed geometries

Authors: Max O. Bloomfield, Zhen Li, Brian Granzow, Daniel A. Ibanez, Assad A. Oberai, Glen A. Hansen, Xiao Hu Liu, Mark S. Shephard

Published in: Engineering with Computers | Issue 3/2017

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Abstract

Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array.
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Appendix
Available only for authorised users
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Metadata
Title
Component-based workflows for parallel thermomechanical analysis of arrayed geometries
Authors
Max O. Bloomfield
Zhen Li
Brian Granzow
Daniel A. Ibanez
Assad A. Oberai
Glen A. Hansen
Xiao Hu Liu
Mark S. Shephard
Publication date
21-11-2016
Publisher
Springer London
Published in
Engineering with Computers / Issue 3/2017
Print ISSN: 0177-0667
Electronic ISSN: 1435-5663
DOI
https://doi.org/10.1007/s00366-016-0487-5

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