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2019 | OriginalPaper | Chapter

16. Contact-Type Micro Thermal Sensor for Surface Defect Detection

Author : Yuki Shimizu

Published in: Metrology

Publisher: Springer Singapore

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Abstract

Surface defect detection, which is carried out in advance of defect review process during surface defect inspection of products having smoothly finished surfaces such as bare semiconductor wafers, magnetic disks, and optical components, is important process to assure the quality of products. In this chapter, a surface defect detection method, in which defect detection is carried out in such a way that the existence of a surface defect on a target of interest is verified by detecting frictional heat induced by a collision between a micro thermal sensor and a surface defect, is described. Although the frictional heat to be generated by a collision between the micro thermal sensor and a surface defect is expected to be small since surface defects required to be verified during the inspection are quite small, the micro thermal sensor designed to have a micrometric sensor element is expected to carry out highly sensitive detection of the frictional heat and thus realize high-resolution surface defect detection. A principle of the surface defect detection method based on the micro thermal sensor is at first described. After that, design and fabrication of the micro thermal sensor based on photolithography process are presented. In addition, by using the developed micro thermal sensor, some experiments have been carried out to demonstrate the feasibility of the defect detection method. An example of the application of micro thermal sensor for surface defect detection in the hard disk drive industry is also introduced.

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Literature
go back to reference Attota R, Silver R (2011) Nanometrology using a through-focus scanning optical microscopy method. Meas Sci Technol 22:024002. 10ppCrossRef Attota R, Silver R (2011) Nanometrology using a through-focus scanning optical microscopy method. Meas Sci Technol 22:024002. 10ppCrossRef
go back to reference Gustafsson SE (1991) Transient plane source techniques for thermal conductivity and thermal diffusivity measurements of solid materials. Rev Sci Instrum 62:797–804CrossRef Gustafsson SE (1991) Transient plane source techniques for thermal conductivity and thermal diffusivity measurements of solid materials. Rev Sci Instrum 62:797–804CrossRef
go back to reference Johnson KL (1982) One hundred years of hertz contact. Proc Inst Mech Eng 196:363–378CrossRef Johnson KL (1982) One hundred years of hertz contact. Proc Inst Mech Eng 196:363–378CrossRef
go back to reference Lonardo PM (1991) Surface characterization and defect detection by analysis of images obtained with coherent light. CIRP Ann – Manuf Techn 40:541–544CrossRef Lonardo PM (1991) Surface characterization and defect detection by analysis of images obtained with coherent light. CIRP Ann – Manuf Techn 40:541–544CrossRef
go back to reference Lu W, Shimizu Y, Ito S, Gao W (2012) Design and experiment of thermal contact sensor detecting defects on Si wafer surface. Key Eng Mater 523–524:826–831CrossRef Lu W, Shimizu Y, Ito S, Gao W (2012) Design and experiment of thermal contact sensor detecting defects on Si wafer surface. Key Eng Mater 523–524:826–831CrossRef
go back to reference Meshulach D, Dolev I, Yamazaki Y, Tsuchiya K, Kaneko M, Yoshino K, Fujii T (2010) Advanced lithography: wafer defect scattering analysis at DUV. Proc SPIE 7638:76380K. (10pp)CrossRef Meshulach D, Dolev I, Yamazaki Y, Tsuchiya K, Kaneko M, Yoshino K, Fujii T (2010) Advanced lithography: wafer defect scattering analysis at DUV. Proc SPIE 7638:76380K. (10pp)CrossRef
go back to reference Montal O, Dotat K, Mebarki B, Man-Ping C, Ngai C (2010) DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning. Solid State Techn 53:16–19 Montal O, Dotat K, Mebarki B, Man-Ping C, Ngai C (2010) DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning. Solid State Techn 53:16–19
go back to reference Pan J, Tai DH (2011) A new strategy for defect inspection by the virtual inspection in semiconductor wafer fabrication. Comp Ind Eng 60:16–24CrossRef Pan J, Tai DH (2011) A new strategy for defect inspection by the virtual inspection in semiconductor wafer fabrication. Comp Ind Eng 60:16–24CrossRef
go back to reference Shimizu Y, Xu J, Kohira H, Kurita M, Shiramatsu T, Furukawa M (2011) Nano-scale defect mapping on a magnetic disk surface using a contact sensor. IEEE Trans Magn 47(10):3426–3432CrossRef Shimizu Y, Xu J, Kohira H, Kurita M, Shiramatsu T, Furukawa M (2011) Nano-scale defect mapping on a magnetic disk surface using a contact sensor. IEEE Trans Magn 47(10):3426–3432CrossRef
go back to reference Shimizu Y, Lu W, Ohba Y, Gao W (2014a) Feasibility study on the concept of thermal contact sensor for nanometre-level defect inspections on smooth surfaces. Meas Sci Technol 25:064006. (11pp)CrossRef Shimizu Y, Lu W, Ohba Y, Gao W (2014a) Feasibility study on the concept of thermal contact sensor for nanometre-level defect inspections on smooth surfaces. Meas Sci Technol 25:064006. (11pp)CrossRef
go back to reference Shimizu Y, Ohba Y, Gao W (2015) Investigation on sensitivity of a contact-type thermal sensor for surface defect inspections. Int J Autom Technol 9(3):291–296CrossRef Shimizu Y, Ohba Y, Gao W (2015) Investigation on sensitivity of a contact-type thermal sensor for surface defect inspections. Int J Autom Technol 9(3):291–296CrossRef
go back to reference Takahashi S, Miyoshi T, Takaya Y, Saito K (1998) In-process measurement method for detection and discrimination of silicon wafer surface defects by laser scattered defect pattern. CIRP Ann Manuf Techn 47:459–462CrossRef Takahashi S, Miyoshi T, Takaya Y, Saito K (1998) In-process measurement method for detection and discrimination of silicon wafer surface defects by laser scattered defect pattern. CIRP Ann Manuf Techn 47:459–462CrossRef
go back to reference Takahashi S, Kudo R, Usuki S, Takamasu K (2011) Super resolution optical measurements of nanodefects on Si wafer surface using infrared standing evanescent wave. CIRP Ann Manuf Techn 60:523–526CrossRef Takahashi S, Kudo R, Usuki S, Takamasu K (2011) Super resolution optical measurements of nanodefects on Si wafer surface using infrared standing evanescent wave. CIRP Ann Manuf Techn 60:523–526CrossRef
go back to reference Takami K (1997) Defect inspection of wafers by laser scattering. Mat Sci Eng :B 44:181–187CrossRef Takami K (1997) Defect inspection of wafers by laser scattering. Mat Sci Eng :B 44:181–187CrossRef
go back to reference Tan CM, Lau KT (2011) Automated wafer defect map generation for process yield improvement. Proceedings of the 13th international symposium on integrated circuits, Singapore, 2011 Tan CM, Lau KT (2011) Automated wafer defect map generation for process yield improvement. Proceedings of the 13th international symposium on integrated circuits, Singapore, 2011
go back to reference Wagner C, Harned N (2010) Lithography gets extreme. Nat Photonics 4:24–26CrossRef Wagner C, Harned N (2010) Lithography gets extreme. Nat Photonics 4:24–26CrossRef
go back to reference Xu C, Lee J, Sachan V, Patterson OD (2013) defect sampling methodology for yield learning during 22nm process development. Proceedings of IEEE advanced semiconductor manufacturing conference, New York, 2013 Xu C, Lee J, Sachan V, Patterson OD (2013) defect sampling methodology for yield learning during 22nm process development. Proceedings of IEEE advanced semiconductor manufacturing conference, New York, 2013
Metadata
Title
Contact-Type Micro Thermal Sensor for Surface Defect Detection
Author
Yuki Shimizu
Copyright Year
2019
Publisher
Springer Singapore
DOI
https://doi.org/10.1007/978-981-10-4938-5_18

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