Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy

The Sn–3.5 wt%Ag alloy considered as a good alternative to Pb–Sn alloys. This study aims to investigate the effects of Cu or Sb additions by 3 or 5 wt% to melt-spun Sn–3.5%Ag alloy. Ternary melt-spun Sn–Ag–Cu and Sn–Ag–Sb alloys investigated using X-ray diffractions (XRD), Scanning electron microscope (SEM), Dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and Differential scanning calorimetry (DSC). The results revealed that the microstructures of the β-Sn phase, Ag₃Sn and Cu₃Sn intermetallic compounds (IMCs) in the solder matrices were refined due to the effect of Cu additions and melt-spun process. Moreover, increasing Cu content promotes Ag₃Sn intermetallic compound (IMC) formation. Consequently, the addition of “3 wt%” of Cu reduced the creep rate ɛ from (3.79 × 10⁻³) to (1.65 × 10⁻³) and delayed the fracture point. The tensile results showed an improvement in Young’s modulus by 47% (30.3 GPa), ultimate tensile strength (UST) by 11.6% (23.9 MPa), and in toughness by 20.5% (952.32 J/m³) compared to the eutectic Sn–Ag alloy. Vickers hardness has improved by 3.3% (136.71 MPa) and thermal activation energy by 54% (90.40 KJ/mol) when compared with that of eutectic Sn–Ag alloy. Those improvements are related to the lack of lattice strain from 7.56 × 10⁻⁴ without “3 wt%” of Cu to 5.26 × 10⁻⁴ with “3 wt%” of Cu. Its melting temperature (T_m) increased by 3 °C due to Ag₃Sn IMC increased and Cu₃Sn formation, but the pasty rang (mushy zone) decreased by 4 °C with “3 wt%” of Cu. The small lattice strains resulted with “3 wt%” of Cu made the electrical resistivity of this alloy more stable at elevated temperatures. The mechanical, thermal and electrical improvements of Sn_93.5–Ag_3.5–Cu₃ alloy provide good physical performance for soldering process and electronic assembly.