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Published in:
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2014 | OriginalPaper | Chapter

1. Copper Electrodepositon

Author : Masayuki Yokoi

Published in: Copper Electrodeposition for Nanofabrication of Electronics Devices

Publisher: Springer New York

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Abstract

Copper sulfate (CuSO4·5H2O) and sulfuric acid (H2SO4) are the primary constituents of the Acid copper sulfate bath [1]. The formulation of the bath is adjusted depending on the intended use, as given in Table 1.1.

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Metadata
Title
Copper Electrodepositon
Author
Masayuki Yokoi
Copyright Year
2014
Publisher
Springer New York
Book
Copper Electrodeposition for Nanofabrication of Electronics Devices

Print ISBN: 978-1-4614-9175-0

Electronic ISBN: 978-1-4614-9176-7

Copyright Year: 2014

DOI
https://doi.org/10.1007/978-1-4614-9176-7_1

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