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Journal of Materials Science: Materials in Electronics

Copper/functionalized-carbon nanotubes composite films with ultrahigh electrical conductivity prepared by pulse reverse electrodeposition

  • 21-07-2020
Published in:
Authors
Dawei Li
Jiangli Xue
Tingting Zuo
Zhaoshun Gao
Liye Xiao
Li Han
Shaofu Li
Yafeng Yang
Published in
Journal of Materials Science: Materials in Electronics | Issue 17/2020

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Abstract

Carbon nanotubes (CNTs) have been proved a significant role as the reinforcement material in improving the mechanical and electrical properties of metal matrix composites due to their high mechanical properties, excellent electrical and thermal conductivity as well as unique atomic structure. In addition, the dispersion of CNTs has been a key factor in fabricating of metal-based complex especially for copper (Cu) with performance improvement. In the present paper, the well dispersion of functionalized CNTs (F-CNTs) is obtained at the first time, accompanied by using pulse reverse electrodeposition (PRED) technology, leading to formation of the ultrahigh electrical conductivity composite films of Cu/F-CNTs. These composite films exhibit an ultrahigh electrical conductivity of up to 6.1 × 107 S/m (increased by 105.4% of that international annealed copper standard, IACS), but maintain a high hardness of 82.3 HV and tensile strength of 297.1 MPa. It is believed that this work opens new perspectives to develop ultrahigh electrical conductivity composite materials and would role as electric wire for reducing energy loss.

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previous article Constructing 3D porous SnO2 nanomaterials for enhanced formaldehyde sensing performances
next article Fast and facile sonochemical synthesis of Mg- and Zn-doped PbS nanospheres: optical properties and photocatalytic activity
Title
Copper/functionalized-carbon nanotubes composite films with ultrahigh electrical conductivity prepared by pulse reverse electrodeposition
Authors
Dawei Li
Jiangli Xue
Tingting Zuo
Zhaoshun Gao
Liye Xiao
Li Han
Shaofu Li
Yafeng Yang
Publication date
21-07-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 17/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-03974-8
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This content is only visible if you are logged in and have the appropriate permissions.

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