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Journal of Materials Science
Published in: Journal of Materials Science 8/2018

02-11-2017 | Interface Behavior

Deformation response of grain boundary networks at high temperature

Authors: Laura Smith, Diana Farkas

Published in: Journal of Materials Science | Issue 8/2018

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Abstract

The deformation response of random grain boundary networks as a function of temperature and strain rate is explored using molecular dynamics atomistic simulations and an embedded atom method interatomic potential. We find that deformation at higher temperatures promotes both dislocation emission and grain boundary accommodation processes. The results allow estimating the activation energies and volumes for the deformation process. We find activation energy values for the deformation process similar to those for grain boundary diffusion and activation volumes consistent with an atomic shuffling mechanism. Our results suggest a picture of the deformation process as governed by the combination of the applied stress and thermally activated processes.
previous article Uniaxial deformation of face-centered-cubic(Ni)-ordered B2(NiAl) bicrystals: atomistic mechanisms near a Kurdjumov–Sachs interface
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Metadata
Title
Deformation response of grain boundary networks at high temperature
Authors
Laura Smith
Diana Farkas
Publication date
02-11-2017
Publisher
Springer US
Published in
Journal of Materials Science / Issue 8/2018
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-017-1760-8

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