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Published in: Journal of Materials Science: Materials in Electronics 11/2019

29-04-2019

Dielectric properties and surface potential decay characteristics of low density polyethylene/ZnO microvaristor composites

Authors: Yongsen Han, Yunyan Xia, Changyou Suo, Yunlong Sun

Published in: Journal of Materials Science: Materials in Electronics | Issue 11/2019

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Abstract

This paper focuses on the effects of submicron ZnO microvaristors on the microstructure and electrical properties of low density polyethylene (LDPE) based composites. The submicron ZnO microvaristors are obtained by ball milling method and are used as a filler of LDPE based composites. The submicron composites with the filler loading of 0, 10, 20, 30 and 40 wt% are prepared by melt-blending method. The morphology, crystallization behavior, dielectric properties and surface potential decay characteristics are characterized by scanning electron microscope, differential scanning calorimetry, dielectric spectrum and surface potential decay measurement, respectively. Experimental results show that the average speed of the surface potential decay characteristics of LDPE based composites increases distinctly with the increasing filler loading. The submicron ZnO microvaristors are in favorable to suppress the charge accumulation of LDPE based composites and can be used to regulate the charge distribution in electrical and electronic equipment.

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Literature
1.
go back to reference G. Mazzanti, G.C. Montanari, L.A. Dissado, IEEE Trans. Dielectr. Electr. Insul. 12(5), 876 (2005)CrossRef G. Mazzanti, G.C. Montanari, L.A. Dissado, IEEE Trans. Dielectr. Electr. Insul. 12(5), 876 (2005)CrossRef
2.
go back to reference N. Zhao, Y. Nie, S. Li, J. Mater. Sci. Mater. Electron. 29(15), 12850 (2018)CrossRef N. Zhao, Y. Nie, S. Li, J. Mater. Sci. Mater. Electron. 29(15), 12850 (2018)CrossRef
3.
go back to reference Y. Wang, C. Wang, W. Chen, K. Xiao, IEEE Trans. Dielectr. Electr. Insul. 23(3), 1713 (2016)CrossRef Y. Wang, C. Wang, W. Chen, K. Xiao, IEEE Trans. Dielectr. Electr. Insul. 23(3), 1713 (2016)CrossRef
4.
5.
go back to reference F. Tian, J. Zhang, X. Peng, C. Hou, IEEE Trans. Dielectr. Electr. Insul. 24(3), 1888 (2017)CrossRef F. Tian, J. Zhang, X. Peng, C. Hou, IEEE Trans. Dielectr. Electr. Insul. 24(3), 1888 (2017)CrossRef
6.
go back to reference B. Du, Z. Li, Z. Yang, IEEE Trans. Dielectr. Electr. Insul. 23(5), 3108 (2016)CrossRef B. Du, Z. Li, Z. Yang, IEEE Trans. Dielectr. Electr. Insul. 23(5), 3108 (2016)CrossRef
7.
go back to reference J. Li, B. Du, X. Kong, Z. Li, IEEE Trans. Dielectr. Electr. Insul. 24(3), 1566 (2017)CrossRef J. Li, B. Du, X. Kong, Z. Li, IEEE Trans. Dielectr. Electr. Insul. 24(3), 1566 (2017)CrossRef
8.
go back to reference L. Donzel, F. Greuter, T. Christen, IEEE Electr. Insul. Mag. 27(2), 18 (2011)CrossRef L. Donzel, F. Greuter, T. Christen, IEEE Electr. Insul. Mag. 27(2), 18 (2011)CrossRef
9.
go back to reference Y. Han, S. Li, D. Min, Sens. Mater. 29(8), 1159 (2017) Y. Han, S. Li, D. Min, Sens. Mater. 29(8), 1159 (2017)
10.
go back to reference S. Li, J. Lin, J. He, W. Liu, J. Mater. Sci. Mater. Electron. 28(18), 13905 (2017)CrossRef S. Li, J. Lin, J. He, W. Liu, J. Mater. Sci. Mater. Electron. 28(18), 13905 (2017)CrossRef
13.
go back to reference S. Ishibe, M. Mori, M. Kozako, M. Hikita, IEEE Trans. Power Del. 29(2), 677 (2014)CrossRef S. Ishibe, M. Mori, M. Kozako, M. Hikita, IEEE Trans. Power Del. 29(2), 677 (2014)CrossRef
15.
go back to reference J. Hong, L. Schadler, R. Siegel, E. Martensson, Appl. Phys. Lett. 82(12), 1956 (2003)CrossRef J. Hong, L. Schadler, R. Siegel, E. Martensson, Appl. Phys. Lett. 82(12), 1956 (2003)CrossRef
16.
go back to reference S.M. Lebedev, O.S. Gefle, A.E. Strizhkov, IEEE Trans. Dielectr. Electr. Insul. 20(1), 289 (2013)CrossRef S.M. Lebedev, O.S. Gefle, A.E. Strizhkov, IEEE Trans. Dielectr. Electr. Insul. 20(1), 289 (2013)CrossRef
17.
go back to reference Y. Han, S. Li, D. Min, IEEE Trans. Dielectr. Electr. Insul. 24(5), 3154 (2017)CrossRef Y. Han, S. Li, D. Min, IEEE Trans. Dielectr. Electr. Insul. 24(5), 3154 (2017)CrossRef
18.
go back to reference S. Li, Y. Nie, W. Wang, L. Yang, D. Min, IEEE Trans. Dielectr. Electr. Insul. 23(5), 3215 (2016)CrossRef S. Li, Y. Nie, W. Wang, L. Yang, D. Min, IEEE Trans. Dielectr. Electr. Insul. 23(5), 3215 (2016)CrossRef
19.
go back to reference J. Li, F. Zhou, D. Min, S. Li, R. Xia, IEEE Trans. Dielectr. Electr. Insul. 22(3), 1723 (2015)CrossRef J. Li, F. Zhou, D. Min, S. Li, R. Xia, IEEE Trans. Dielectr. Electr. Insul. 22(3), 1723 (2015)CrossRef
20.
go back to reference Y. Han, S. Li, D. Min, IEEE Trans. Dielectr. Electr. Insul. 25(2), 639 (2018)CrossRef Y. Han, S. Li, D. Min, IEEE Trans. Dielectr. Electr. Insul. 25(2), 639 (2018)CrossRef
21.
go back to reference X. Huang, Q. Ke, C. Kim, H. Zhong, P. Wei, G. Wang, F. Liu, P. Jiang, Polym. Eng. Sci. 47(7), 1052 (2010)CrossRef X. Huang, Q. Ke, C. Kim, H. Zhong, P. Wei, G. Wang, F. Liu, P. Jiang, Polym. Eng. Sci. 47(7), 1052 (2010)CrossRef
22.
go back to reference A. Tracz, I. Kucinska, D. Wojciechowska, J. Jeszka, Eur. Polym. J. 41(3), 501 (2005)CrossRef A. Tracz, I. Kucinska, D. Wojciechowska, J. Jeszka, Eur. Polym. J. 41(3), 501 (2005)CrossRef
23.
go back to reference T. Dollase, M. Wilhelm, H. Spiess, Y. Yagen, R. Rozen, M. Gottlieb, Interface Sci. 11(2), 199 (2003)CrossRef T. Dollase, M. Wilhelm, H. Spiess, Y. Yagen, R. Rozen, M. Gottlieb, Interface Sci. 11(2), 199 (2003)CrossRef
24.
go back to reference S. Alapati, J.T. Meledath, A. Karmarkar, I.E.T. Sci, Meas. Technol. 8(2), 60 (2014) S. Alapati, J.T. Meledath, A. Karmarkar, I.E.T. Sci, Meas. Technol. 8(2), 60 (2014)
25.
go back to reference S. Li, G. Yin, S. Bai, J. Li, IEEE Trans. Dielectr. Electr. Insul. 18(5), 1535 (2011)CrossRef S. Li, G. Yin, S. Bai, J. Li, IEEE Trans. Dielectr. Electr. Insul. 18(5), 1535 (2011)CrossRef
26.
go back to reference B. Zhang, W. Gao, P. Chu, Z. Zhang, G. Zhang, J. Mater. Sci. Mater. Electron. 29(3), 1964 (2018)CrossRef B. Zhang, W. Gao, P. Chu, Z. Zhang, G. Zhang, J. Mater. Sci. Mater. Electron. 29(3), 1964 (2018)CrossRef
27.
Metadata
Title
Dielectric properties and surface potential decay characteristics of low density polyethylene/ZnO microvaristor composites
Authors
Yongsen Han
Yunyan Xia
Changyou Suo
Yunlong Sun
Publication date
29-04-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 11/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01410-0

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