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Published in:
01-12-2012
Diffusion mechanism in the gold-copper system
Published in: Journal of Materials Science: Materials in Electronics | Issue 12/2012
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Abstract
Interdiffusion study is conducted in the Au–Cu system, which has complete solid solution in the higher temperature range and ordered phases in the lower temperature range. First experiments are conducted at higher temperatures, where atoms can diffuse randomly. Higher values of interdiffusion coefficients are found in the range of 40–50 at.% Cu. This trend is explained with the help of thermodynamic factor and possible concentration of vacancies. Following an experiment is conducted at 623 K (350 °C), where the ordered phases are grown. The interdiffusion coefficients at this temperature are compared after extrapolating the data calculated at higher temperatures.