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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 5/2014

01-05-2014

Effect of doping Al on the liquid oxidation of Sn–Bi–Zn solder

Authors: X. J. Wang, Q. S. Zhu, B. Liu, N. Liu, F. J. Wang

Published in: Journal of Materials Science: Materials in Electronics | Issue 5/2014

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Abstract

The liquid oxidation behaviors of Sn–40Bi–2Zn and Sn–40Bi–2Zn–0.005Al solders were investigated from thermal dynamics and kinetics analysis. The characteristics of surface oxidation film at 170 °C were studied by thermo gravimetric analysis and X-ray photoelectron spectroscopy (XPS). Sn–40Bi–2Zn solder performed inferiorly in oxidation prevention performance, due to the formation of ZnO, which exhibits lower Gibbs free energy of formation and higher growth rate. Trace amount of Al addition, however, alleviated the oxidation behavior of Zn. XPS depth profile results indicated that the surface layer of Sn–40Bi–2Zn–0.005Al consisted of oxides of Al and Zn formed on the outer surface of the solder film and in the subsequent layer, mainly formed by the oxides of Sn, Bi. Al, basically formed as Al2O3, segregated towards the outer surface, seemed to deter the Zn oxidation on the solder surface.
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Metadata
Title
Effect of doping Al on the liquid oxidation of Sn–Bi–Zn solder
Authors
X. J. Wang
Q. S. Zhu
B. Liu
N. Liu
F. J. Wang
Publication date
01-05-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 5/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-1875-5

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