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Published in: Journal of Materials Science 8/2009

01-04-2009

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

Authors: Hongwen He, Guangchen Xu, Fu Guo

Published in: Journal of Materials Science | Issue 8/2009

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Abstract

Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC) was investigated with current density of 5 × 103 A/cm2 at room temperature and 100 °C, respectively. Results indicate that tiny RE addition to eutectic SnBi solder alloy can make the energy of interfaces and grain boundaries decrease, restrain the movement of dislocations and grain boundary sliding. Therefore, phase segregation and IMC growth will be effectively suppressed which enhances the electromigration resistance.

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Metadata
Title
Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple
Authors
Hongwen He
Guangchen Xu
Fu Guo
Publication date
01-04-2009
Publisher
Springer US
Published in
Journal of Materials Science / Issue 8/2009
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-009-3276-3

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