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Journal of Materials Engineering and Performance

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06-01-2022 | Technical Article

Effect of Stress Relaxation Aging on Precipitation Kinetics of Al–Cu–Li Alloy

Authors: Hailong Liao, Lihua Zhan, Feng Xia, Minghui Huang, Chunhui Liu

Published in: Journal of Materials Engineering and Performance | Issue 5/2022

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Abstract

In this paper, Vickers hardness measurements, transmission electron microscopy (TEM) X-ray diffraction (XRD) peak-broadening analysis, and differential scanning calorimetry (DSC) were employed to investigate the effect of applying stress during aging treatment on the precipitation kinetics of Al–Cu–Li alloy. For non-isothermal kinetics, the activation energy of stress relaxation aging (SRA) was lower than that of artificial aging (AA). SRA not only reduced the activation energy, but also maintained the precipitation sequence of 2195 Al–Cu–Li alloys. For SRA- and AA-treated material, endothermic peaks of T₁ phase have been observed during DSC at 235.2 and 238.5 °C, respectively. According to hardness and TEM tests, calculated Avrami exponent value of the T₁ phase, and full characterization of the morphology of the T₁ phase, the analysis of the isothermal precipitation kinetics is consistent with the non-isothermal precipitation kinetics analysis of the T₁ phase based on Johnson–Mehl–Avrami (JMA) calculations. Therefore, the precipitation mechanism is essentially the same for both aging treatments. The analysis results of the isothermal and non-isothermal kinetics show that SRA can promote the precipitation of T₁ and reduce the activation energy of the nucleation of T₁, and find dislocation-induced SRA measured by XRD affected precipitation kinetics to a certain extent.

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Title: Effect of Stress Relaxation Aging on Precipitation Kinetics of Al–Cu–Li Alloy
Authors: Hailong Liao
Lihua Zhan
Feng Xia
Minghui Huang
Chunhui Liu
Publication date: 06-01-2022
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 5/2022
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-021-06478-6

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