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Journal of Electronic Materials
Published in: Journal of Electronic Materials 1/2005

01-01-2005 | Regular Issue Paper

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Authors: Young-Doo Jeon, Kyung-Wook Paik, Adreas Ostmann, Herbert Reichl

Published in: Journal of Electronic Materials | Issue 1/2005

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previous article The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization
next article Effect of off-orientation of seed crystal on silicon carbide (SiC) single-crystal growth on the (110) surface0) surface

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Metadata
Title
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
Authors
Young-Doo Jeon
Kyung-Wook Paik
Adreas Ostmann
Herbert Reichl
Publication date
01-01-2005
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 1/2005
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-005-0183-5

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Regular Issue Paper

Effect of off-orientation of seed crystal on silicon carbide (SiC) single-crystal growth on the (11 $$\bar 2$$ 0) surface0) surface

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Texture investigation of copper interconnects with a different line width

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Uniform Cr2+ doping of physical vapor transport grown CdSxSe1−x crystals

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Effect of bismuth addition on sintering behavior and microwave dielectric properties of zinc titanate ceramics

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Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering

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Correlation of in-situ reflectance spectra and resistivity of GaN/Al2O3 interfacial layer in metalorganic chemical vapor deposition