Embedded Digital Speckle Pattern Interferometry for Three-dimensional Strain Analysis

The extension of Digital Speckle Pattern Interferometry to three-dimensional cases poses new challenges from both the practical and the theoretical points of view. In the present research, a scattering surface was created within a transparent Plexiglas specimen with the aid of atomized aluminum particles, and strain was measured in the interior plane. Test specimen configurations included a beam in bending and a disc in diametral compression. The tests on the beam in bending showed excellent agreement between Embedded DSPI results and resistance strain gages. However, for the disc in compression, large discrepancies were found. The main source of errors was identified in the effect of the refractive index gradient. Based on the assumption that the index of refraction changes proportionally to the local dilatation, the error was calculated and the predicted results were ultimately in good agreement with the DSPI data. In conclusion, the Embedded DSPI technique was found to be a viable tool for direct experimental strain investigation of complex 3-D cases.