1996 | OriginalPaper | Chapter
Equipment Design, Cluster Tools and Scale-Up Issues
Authors : L. Deutschmann, F. Glowacki
Published in: Advances in Rapid Thermal and Integrated Processing
Publisher: Springer Netherlands
Included in: Professional Book Archive
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The present contribution gives some insight into equipment design. It is not possible to cover everything concerning design. Therefore, this contribution is mainly focused on the design of MESC (Modular Equipment Standards Committee) compatible cluster tools for RTP applications which is followed by some remarks concerning the scale-up in terms of wafer size. Due to the fact, that the design of the cluster modules was started from the basic design of the stand-alone RTP—system, a brief description of this chamber will be given prior to more specific considerations about cluster design.