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Published in: Journal of Materials Science: Materials in Electronics 17/2018

12-07-2018

Fabrication of stabilized and dispersive copper nanowires ink

Authors: Meng Yuan, Jing Xu, Qiang Chen, Dongsheng Li, Deren Yang

Published in: Journal of Materials Science: Materials in Electronics | Issue 17/2018

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Abstract

In this paper, an organic stabilized and dispersive Cu nanowires (NWs) ink was proposed. We investigated and determined the recipe of the expectant ink framework and proved its usage as flexible transparent conductive films. The influences of main solutes on stability and dispersity of the ink were discussed detailedly. The stability was evaluated by the sedimentation time of the ink and the dispersity was weighed by the morphology of the freely-dispersed Cu NWs ink on substrates. The electric properties of the following conductive films were obatained by Hall effect measurement system. A simple and efficient method has carried out for fabricating the transparent electrodes from the prepared Cu NWs ink. These electrodes possessed a good performance in both conductivity and transmittance, which verified the pragmaticality of suggested Cu NWs ink as well. Typically, the sheet resistances of the processed electrodes made by the plasma enhanced chemical vapor deposition technique were about 80 Ω·sq−1, and the light transmittances at 550 nm were over 80%. The figures of merit of them were over 10−3 Ω−1.

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Literature
1.
go back to reference H. Hwang, A. Kim, Z. Zhong, H. Kwon, S. Jeong, J. Moon, Adv. Funct. Mater. 26, 6545 (2016)CrossRef H. Hwang, A. Kim, Z. Zhong, H. Kwon, S. Jeong, J. Moon, Adv. Funct. Mater. 26, 6545 (2016)CrossRef
3.
5.
go back to reference H. Guo, N. Lin, Y. Chen, Z. Wang, Q. Xie, T. Zheng, N. Gao, S. Li, J. Kang, D. Cai, D. Peng, Sci. Rep. 3, 2323 (2013)CrossRef H. Guo, N. Lin, Y. Chen, Z. Wang, Q. Xie, T. Zheng, N. Gao, S. Li, J. Kang, D. Cai, D. Peng, Sci. Rep. 3, 2323 (2013)CrossRef
6.
go back to reference H. Chu, Y. Chang, Y. Lin, S. Chang, W. Chang, G. Li, H. Tuan, ACS Appl. Mater. Interface 8, 13009 (2016)CrossRef H. Chu, Y. Chang, Y. Lin, S. Chang, W. Chang, G. Li, H. Tuan, ACS Appl. Mater. Interface 8, 13009 (2016)CrossRef
7.
go back to reference S. Han, S. Hong, J. Ham, J. Yeo, J. Lee, B. Kang, P. Lee, J. Kwon, S.S. Lee, M. Yang, S.H. Ko, Adv. Mater. 26, 5808 (2014)CrossRef S. Han, S. Hong, J. Ham, J. Yeo, J. Lee, B. Kang, P. Lee, J. Kwon, S.S. Lee, M. Yang, S.H. Ko, Adv. Mater. 26, 5808 (2014)CrossRef
8.
go back to reference H. Im, S. Jung, J. Jin, D. Lee, J. Lee, D. Lee, J. Lee, I. Kim, B. Bae, ACS Nano 8, 10973 (2014)CrossRef H. Im, S. Jung, J. Jin, D. Lee, J. Lee, D. Lee, J. Lee, I. Kim, B. Bae, ACS Nano 8, 10973 (2014)CrossRef
9.
10.
go back to reference D.P. Langley, G. Giusti, M. Lagrange, R. Collins, C. Jiménez, Y. Bréchet, D. Bellet, Sol. Energy Mater. Sol. C 125, 318 (2014)CrossRef D.P. Langley, G. Giusti, M. Lagrange, R. Collins, C. Jiménez, Y. Bréchet, D. Bellet, Sol. Energy Mater. Sol. C 125, 318 (2014)CrossRef
11.
go back to reference C. Preston, Z. Fang, J. Murray, H. Zhu, J. Dai, J.N. Munday, L. Hu, J. Mater. Chem. C 2, 1248 (2014)CrossRef C. Preston, Z. Fang, J. Murray, H. Zhu, J. Dai, J.N. Munday, L. Hu, J. Mater. Chem. C 2, 1248 (2014)CrossRef
12.
go back to reference B. Sciacca, J. van de Groep, A. Polman, E.C. Garnett, Adv. Mater. 28, 905 (2016)CrossRef B. Sciacca, J. van de Groep, A. Polman, E.C. Garnett, Adv. Mater. 28, 905 (2016)CrossRef
13.
go back to reference S. De, T.M. Higgins, P.E. Lyons, E.M. Doherty, P.N. Nirmalraj, W.J. Blau, J.J. Boland, J.N. Coleman, ACS Nano 3, 1767 (2009)CrossRef S. De, T.M. Higgins, P.E. Lyons, E.M. Doherty, P.N. Nirmalraj, W.J. Blau, J.J. Boland, J.N. Coleman, ACS Nano 3, 1767 (2009)CrossRef
14.
go back to reference Z. Wu, A.F. Hebard, A.G. Rinzler, Z. Chen, X. Du, J.M. Logan, J. Sippel, M. Nikolou, K. Kamaras, J.R. Reynolds, D.B. Tanner, Science 305, 1273 (2004)CrossRef Z. Wu, A.F. Hebard, A.G. Rinzler, Z. Chen, X. Du, J.M. Logan, J. Sippel, M. Nikolou, K. Kamaras, J.R. Reynolds, D.B. Tanner, Science 305, 1273 (2004)CrossRef
16.
go back to reference S. Bae, H. Kim, Y. Lee, X. Xu, J. Park, Y. Zheng, J. Balakrishnan, T. Lei, H. Ri Kim, Y.I. Song, Y. Kim, K.S. Kim, B. Özyilmaz, J. Ahn, B.H. Hong, S. Iijima, Nat. Nanotechnol. 5, 574 (2010)CrossRef S. Bae, H. Kim, Y. Lee, X. Xu, J. Park, Y. Zheng, J. Balakrishnan, T. Lei, H. Ri Kim, Y.I. Song, Y. Kim, K.S. Kim, B. Özyilmaz, J. Ahn, B.H. Hong, S. Iijima, Nat. Nanotechnol. 5, 574 (2010)CrossRef
17.
18.
19.
go back to reference C.Y. Jiang, X.W. Sun, K.W. Tan, G.Q. Lo, A.K.K. Kyaw, D.L. Kwong, Appl. Phys. Lett. 92, 143101 (2008)CrossRef C.Y. Jiang, X.W. Sun, K.W. Tan, G.Q. Lo, A.K.K. Kyaw, D.L. Kwong, Appl. Phys. Lett. 92, 143101 (2008)CrossRef
20.
21.
23.
go back to reference N. Kholmanov, S.H. Domingues, H. Chou, X. Wang, C. Tan, J. Kim, H. Li, R. Piner, A.J.G. Zarbin, R.S. Ruoff, ACS Nano 7, 1811 (2013)CrossRef N. Kholmanov, S.H. Domingues, H. Chou, X. Wang, C. Tan, J. Kim, H. Li, R. Piner, A.J.G. Zarbin, R.S. Ruoff, ACS Nano 7, 1811 (2013)CrossRef
24.
go back to reference Y. Cheng, S. Wang, R. Wang, J. Sun, L. Gao, J. Mater. Chem. C 2, 5309 (2014)CrossRef Y. Cheng, S. Wang, R. Wang, J. Sun, L. Gao, J. Mater. Chem. C 2, 5309 (2014)CrossRef
25.
go back to reference S. Ye, A.R. Rathmell, I.E. Stewart, Y.C. Ha, A.R. Wilson, Z. Chen, B.J. Wiley, Chem. Commun. 50, 9228 (2014)CrossRef S. Ye, A.R. Rathmell, I.E. Stewart, Y.C. Ha, A.R. Wilson, Z. Chen, B.J. Wiley, Chem. Commun. 50, 9228 (2014)CrossRef
27.
go back to reference M. Koczkur, S. Mourdikoudis, L. Polavarapu, S.E. Skrabalak, Dalton Trans. 2015, 17883 (2015)CrossRef M. Koczkur, S. Mourdikoudis, L. Polavarapu, S.E. Skrabalak, Dalton Trans. 2015, 17883 (2015)CrossRef
28.
go back to reference G. Bandekar, N.S. Rajurkar, I.S. Mulla, U.P. Mulik, D.P. Amalnerkar, P.V. Adhyapak, Appl. Nanosci. 4, 199 (2014)CrossRef G. Bandekar, N.S. Rajurkar, I.S. Mulla, U.P. Mulik, D.P. Amalnerkar, P.V. Adhyapak, Appl. Nanosci. 4, 199 (2014)CrossRef
29.
31.
go back to reference A.V. Moholkar, S.M. Pawar, K.Y. Rajpure, V. Ganesan, C.H. Bhosale, J. Alloy. Compd. 464, 387 (2008)CrossRef A.V. Moholkar, S.M. Pawar, K.Y. Rajpure, V. Ganesan, C.H. Bhosale, J. Alloy. Compd. 464, 387 (2008)CrossRef
Metadata
Title
Fabrication of stabilized and dispersive copper nanowires ink
Authors
Meng Yuan
Jing Xu
Qiang Chen
Dongsheng Li
Deren Yang
Publication date
12-07-2018
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 17/2018
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9637-4

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