Skip to main content
Top
Published in: Optical and Quantum Electronics 2/2020

01-02-2020

Features of fused silica ablation by laser induced carbon microplasma

Authors: Cai Shuhao, Vladimir Rymkevich, Maksim Sergeev, Andrey Samokhvalov

Published in: Optical and Quantum Electronics | Issue 2/2020

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The features of surface structuring on the transparent material by laser-induced microplasma were studied and the intensity of its microplasma was measured. The formation of micro-relief by a series of nanosecond pulsed laser induced carbon microplasma in confinement mode on the surface of fused silica were investigated and the measured intensity was compared with the features of micro-relief. The dependence of depth of formed relief and track on the laser regime was determined. It is shown that the mechanism of microstructure formation is dependent on multifactor and associated with the ablation on the surface of fused silica by the microplasma, which exists quite long time after the pulses.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
go back to reference Böhme, R., Zimmer, K., Rauschenbach, B.: Laser backside etching of fused silica due to carbon layer ablation. Appl. Phys. A 82(2), 325–328 (2006)ADSCrossRef Böhme, R., Zimmer, K., Rauschenbach, B.: Laser backside etching of fused silica due to carbon layer ablation. Appl. Phys. A 82(2), 325–328 (2006)ADSCrossRef
go back to reference Gattass, R.R., Mazur, E.: Femtosecond laser micromachining in transparent materials. Nat. Photonics 2(4), 219–225 (2008)ADSCrossRef Gattass, R.R., Mazur, E.: Femtosecond laser micromachining in transparent materials. Nat. Photonics 2(4), 219–225 (2008)ADSCrossRef
go back to reference Herman, P.R., Beckley, K.R., Jackson, B.C., Kurosawa, K., Moore, D., Yamanishi, T., Yang, J.: Processing applications with the 157-nm fluorine excimer laser. In: Proceedings of SPIE 2992, Excimer Lasers, Optics, and Applications, pp. 86–96. International Society for Optics and Photonics (1997) Herman, P.R., Beckley, K.R., Jackson, B.C., Kurosawa, K., Moore, D., Yamanishi, T., Yang, J.: Processing applications with the 157-nm fluorine excimer laser. In: Proceedings of SPIE 2992, Excimer Lasers, Optics, and Applications, pp. 86–96. International Society for Optics and Photonics (1997)
go back to reference Hopp, B., Vass, C., Smausz, T., Bor, Z.: Production of submicrometre fused silica gratings using laser-induced backside dry etching technique. J. Phys. D Appl. Phys. 39(22), 4843–4847 (2006)ADSCrossRef Hopp, B., Vass, C., Smausz, T., Bor, Z.: Production of submicrometre fused silica gratings using laser-induced backside dry etching technique. J. Phys. D Appl. Phys. 39(22), 4843–4847 (2006)ADSCrossRef
go back to reference Hopp, B., Smausz, T., Csizmadia, T., Vass, C., Csákó, T., Szabo, G.: Comparative study of different indirect laser-based methods developed for microprocessing of transparent materials. J. Laser Micro/Nanoeng. 5(1), 80–85 (2010)CrossRef Hopp, B., Smausz, T., Csizmadia, T., Vass, C., Csákó, T., Szabo, G.: Comparative study of different indirect laser-based methods developed for microprocessing of transparent materials. J. Laser Micro/Nanoeng. 5(1), 80–85 (2010)CrossRef
go back to reference Kostyuk, G., Zakoldaev, R., Sergeev, M., Veiko, V.: Laser-induced glass surface structuring by LIBBH technology. Opt. Quantum Electron. 48(4), 249–256 (2016)CrossRef Kostyuk, G., Zakoldaev, R., Sergeev, M., Veiko, V.: Laser-induced glass surface structuring by LIBBH technology. Opt. Quantum Electron. 48(4), 249–256 (2016)CrossRef
go back to reference Kostyuk, G.K., Zakoldaev, R.A., Koval, V.V., Sergeev, M.M., Rymkevich, V.S.: Laser microplasma as a tool to fabricate phase grating applied for laser beam splitting. Opt. Lasers Eng. 92, 63–69 (2017)CrossRef Kostyuk, G.K., Zakoldaev, R.A., Koval, V.V., Sergeev, M.M., Rymkevich, V.S.: Laser microplasma as a tool to fabricate phase grating applied for laser beam splitting. Opt. Lasers Eng. 92, 63–69 (2017)CrossRef
go back to reference Smausz, T., Csizmadia, T., Kresz, N., Vass, C., Márton, Z., Hopp, B.: Influence on the laser induced backside dry etching of thickness and material of the absorber, laser spot size and multipulse irradiation. Appl. Surf. Sci. 254(4), 1091–1095 (2007)ADSCrossRef Smausz, T., Csizmadia, T., Kresz, N., Vass, C., Márton, Z., Hopp, B.: Influence on the laser induced backside dry etching of thickness and material of the absorber, laser spot size and multipulse irradiation. Appl. Surf. Sci. 254(4), 1091–1095 (2007)ADSCrossRef
go back to reference Wang, J., Niino, H., Yabe, A.: One-step microfabrication of fused silica by laser ablation of an organic solution. Appl. Phys. A Mater. Sci. Process. 68(1), 111–113 (1999)ADSCrossRef Wang, J., Niino, H., Yabe, A.: One-step microfabrication of fused silica by laser ablation of an organic solution. Appl. Phys. A Mater. Sci. Process. 68(1), 111–113 (1999)ADSCrossRef
go back to reference Wang, J., Niino, H., Yabe, A.: Micromachining of transparent materials with super-heated liquid generated by multiphotonic absorption of organic molecule. Appl. Surf. Sci. 154, 571–576 (2000)ADSCrossRef Wang, J., Niino, H., Yabe, A.: Micromachining of transparent materials with super-heated liquid generated by multiphotonic absorption of organic molecule. Appl. Surf. Sci. 154, 571–576 (2000)ADSCrossRef
go back to reference Zakoldaev, R., Kostyuk, G., Rymkevich, V., Koval, V., Sergeev, M., Veiko, V., Ya-kovlev, E., Sivers, A.: Fast fabrication of multilevel phase plates used for laser beam correction. J. Laser Micro Nanoeng. 12(3), 281–285 (2017) Zakoldaev, R., Kostyuk, G., Rymkevich, V., Koval, V., Sergeev, M., Veiko, V., Ya-kovlev, E., Sivers, A.: Fast fabrication of multilevel phase plates used for laser beam correction. J. Laser Micro Nanoeng. 12(3), 281–285 (2017)
go back to reference Zhang, J., Sugioka, K., Midorikawa, K.: Direct fabrication of microgratings in fused quartz by laser-induced plasma-assisted ablation with a KrF excimer laser. Opt. Lett. 23(18), 1486–1488 (1998a)ADSCrossRef Zhang, J., Sugioka, K., Midorikawa, K.: Direct fabrication of microgratings in fused quartz by laser-induced plasma-assisted ablation with a KrF excimer laser. Opt. Lett. 23(18), 1486–1488 (1998a)ADSCrossRef
go back to reference Zhang, J., Sugioka, K., Midorikawa, K.: High-speed machining of glass materials by laser-induced plasma-assisted ablation using a 532-nm laser. Appl. Phys. A 67(4), 499–501 (1998b)ADSCrossRef Zhang, J., Sugioka, K., Midorikawa, K.: High-speed machining of glass materials by laser-induced plasma-assisted ablation using a 532-nm laser. Appl. Phys. A 67(4), 499–501 (1998b)ADSCrossRef
go back to reference Zhang, J., Sugioka, K., Midorikawa, K.: Laser-induced plasma-assisted ablation of fused quartz using the fourth harmonic of a Nd + : YAG laser. Appl. Phys. A 67(5), 545–549 (1998c)ADSCrossRef Zhang, J., Sugioka, K., Midorikawa, K.: Laser-induced plasma-assisted ablation of fused quartz using the fourth harmonic of a Nd + : YAG laser. Appl. Phys. A 67(5), 545–549 (1998c)ADSCrossRef
go back to reference Zhang, J., Sugioka, K., Midorikawa, K.: High-quality and high-efficiency machining of glass materials by laser-induced plasma-assisted ablation using conventional nanosecond UV, visible, and infrared lasers. Appl. Phys. A 69(1), S879–S882 (1999)ADSCrossRef Zhang, J., Sugioka, K., Midorikawa, K.: High-quality and high-efficiency machining of glass materials by laser-induced plasma-assisted ablation using conventional nanosecond UV, visible, and infrared lasers. Appl. Phys. A 69(1), S879–S882 (1999)ADSCrossRef
go back to reference Zimmer, K., Böhme, R., Ehrhardt, M., Rauschenbach, B.: Mechanism of backside etching of transparent materials with nanosecond UV-lasers. Appl. Phys. A 101(2), 405–410 (2010)ADSCrossRef Zimmer, K., Böhme, R., Ehrhardt, M., Rauschenbach, B.: Mechanism of backside etching of transparent materials with nanosecond UV-lasers. Appl. Phys. A 101(2), 405–410 (2010)ADSCrossRef
go back to reference Zimmer, K., Ehrhardt, M., Lorenz, P., Wang, X., Vass, C., Csizmadia, T., Hopp, B.: Reducing the incubation effects for rear side laser etching of fused silica. Appl. Surf. Sci. 302, 42–45 (2014)ADSCrossRef Zimmer, K., Ehrhardt, M., Lorenz, P., Wang, X., Vass, C., Csizmadia, T., Hopp, B.: Reducing the incubation effects for rear side laser etching of fused silica. Appl. Surf. Sci. 302, 42–45 (2014)ADSCrossRef
Metadata
Title
Features of fused silica ablation by laser induced carbon microplasma
Authors
Cai Shuhao
Vladimir Rymkevich
Maksim Sergeev
Andrey Samokhvalov
Publication date
01-02-2020
Publisher
Springer US
Published in
Optical and Quantum Electronics / Issue 2/2020
Print ISSN: 0306-8919
Electronic ISSN: 1572-817X
DOI
https://doi.org/10.1007/s11082-020-2202-4

Other articles of this Issue 2/2020

Optical and Quantum Electronics 2/2020 Go to the issue