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Microsystem Technologies
Published in: Microsystem Technologies 10-11/2006

01-09-2006 | Technical paper

HF-contact elements for testing and multi chip module applications

Authors: G. Spanier, E. Slavcheva, W. Mokwa

Published in: Microsystem Technologies | Issue 10-11/2006

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Abstract

In this paper a platform based on the composite IC concept (Semiconductor Industry Association in The NTRS, pp 63, 1994) will be presented that is optimized for high frequency applications. Key elements of the platform are coplanar waveguides and micro springs that are processed using MEMS technologies. Rotation symmetric micro springs with diameters between 500 and 125 μm with different widths and thicknesses were designed, simulated and fabricated. The best mechanical properties were obtained from springs with a diameter of 250 μm. They were made by electroplating of a nickel–tungsten-alloy. FEM simulation of the high frequency performance shows a good performance up to frequencies of 10 GHz.
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Literature
Fritz Th, Mokwa W, Schnakenberg U (2002) Galvanisch abgeschiedene NiW-Legierungsschichten für die Mikrosystemtechnik, Teil 2 Abscheidungen auf der Basis eines Sulfamatelektrolyten. Galvanotechnik 92(10):2684–2690
Fritz T, Griepentrog M, Mokwa W, Schnakenberg U (2003) Determination of Young’s modulus of electroplated nickel. Electrochim Acta 48:3029–3035CrossRef
Keil A, Merl W, Vinaricky E, Schröder KH, Weiser J (2002) Elektrische Kontakte, Werkstoffe und Anwendungen. Springer, Berlin Heidelberg New York, p 524
Krüger C (2003) PhD Thesis, Aachen University
Krüger C, Bartelink DJ, Fritz T, Leuerer T, Mokwa W, Schnakenberg U (2000) Micro springs for temporary chip connection. Sens Actuators A85:371–376CrossRef
Krüger C, Lee IT, Mokwa W, Schnakenberg U (2004) NiW-micro springs for chip connection. In: Proceedings of the 17th IEEE international conference on micro electro mechanical systems, MEMS 2004, Maastricht, January 25–29, 2004, pp 117–120. ISBN 0-7803-8266-8
Semiconductor Industry Association (SIA) (1994) The national technology roadmap for semiconductors, San Jose, pp 63
Metadata
Title
HF-contact elements for testing and multi chip module applications
Authors
G. Spanier
E. Slavcheva
W. Mokwa
Publication date
01-09-2006
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 10-11/2006
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0133-z

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