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Microsystem Technologies
Published in: Microsystem Technologies 3/2006

01-02-2006 | Technical paper

High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

Authors: H. Yang, Reiyu Chein, T. H. Tsai, J. C. Chang, J. C. Wu

Published in: Microsystem Technologies | Issue 3/2006

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Abstract

This paper describes a theoretical model that predicts the metal ion concentration distribution during electroforming high aspect ratio microstructures (HARM). The applied current density and microstructure aspect ratio were found as two important factors that affect the electroforming outcome. The analytical results are verified using experiments that electroforming microstructural posts with an aspect ratio of 10. Good agreement was obtained between the experimental and analytical solutions. Based on the ion concentration analytical prediction on the cathode surface, one can estimate the electroforming time required for fabricating a microstructure for a given aspect ratio.
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Literature
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Varadarajan D et al (2000) A tertiary current distribution model for the pulse plating of copper into high aspect ratio sub-0.25 μm trenches. J Electrochem Soc 147:3382–3392CrossRefMathSciNet
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Metadata
Title
High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process
Authors
H. Yang
Reiyu Chein
T. H. Tsai
J. C. Chang
J. C. Wu
Publication date
01-02-2006
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 3/2006
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-005-0050-6

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