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Published in:
Deformation and Fatigue of Solders Read chapter Read first chapter

2011 | OriginalPaper | Chapter

8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold

Author : P.-E. Tegehall

Published in: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Publisher: Springer London

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Abstract

Solder joints to solder lands plated with electroless nickel and immersion gold are prone to fractures in the interface between the solder and the nickel surface. A common cause for these fractures has been a plating defect in the solder land coating called “black pad”. However, solder joints to solder lands plated with electroless nickel are inclined to fractures even if the black pad defect is not present. The causes of the black pad defect and the mechanisms for the increased inclination for fractures in solder joints to electroless nickel are discussed. Test methods for detecting black pad defects and assessing the risk for fractures in the solder joints are also described.

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Metadata
Title
Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold
Author
P.-E. Tegehall
Copyright Year
2011
Publisher
Springer London
Book
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Print ISBN: 978-0-85729-235-3

Electronic ISBN: 978-0-85729-236-0

Copyright Year: 2011

DOI
https://doi.org/10.1007/978-0-85729-236-0_8