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Diffusion of Water in Adhesives Read chapter Read first chapter

2013 | OriginalPaper | Chapter

Influence of Water on the Interface Properties

Author : Hidetoshi Yamabe

Published in: Design of Adhesive Joints Under Humid Conditions

Publisher: Springer Berlin Heidelberg

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Abstract

It is generally observed that, while the locus of bonding failure of well-prepared metallic adhesive joints is invariably by cohesive fracture in the adhesive layer, after environmental attack it is by apparent interfacial failure between the adhesive and the metallic substrate. The environmental stability of the adhesive-substrate interface and of the oxide, invariably present on metallic substrates, needs therefore to be considered in detail. This chapter considers the service performance of adhesive metallic bonding upon exposure to aqueous environments and reviews the mechanisms of environmental attack and methods for increasing bonding durability.

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previous chapter Influences of Water on the Adhesive Properties
next chapter Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach
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Metadata
Title
Influence of Water on the Interface Properties
Author
Hidetoshi Yamabe
Copyright Year
2013
Publisher
Springer Berlin Heidelberg
Book
Design of Adhesive Joints Under Humid Conditions

Print ISBN: 978-3-642-37613-9

Electronic ISBN: 978-3-642-37614-6

Copyright Year: 2013

DOI
https://doi.org/10.1007/978-3-642-37614-6_5

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