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Published in:
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2017 | OriginalPaper | Chapter

1. Introduction

Authors : Tamanna Alam, Poh-Seng Lee

Published in: Flow Boiling in Expanding Microchannels

Publisher: Springer International Publishing

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Abstract

This chapter presents the need of flow boiling microscale heat sink cooling technique for thermal management in miniaturized electronic devices. The current understanding on this topic and the inhibiting factors associated with it (instabilities, hotspots) for practical applications are discussed. Potential methods, namely, expanding microgap, sloping fin microchannels, and stepped fin microchannels to mitigate drawbacks associated with flow boiling in microscale heat sinks, are highlighted. The aims and objectives of this brief are presented.

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next chapter Flow Boiling Heat Transfer and Pressure Drop Characteristics in Expanding Microgap Channel
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Metadata
Title
Introduction
Authors
Tamanna Alam
Poh-Seng Lee
Copyright Year
2017
Book
Flow Boiling in Expanding Microchannels

Print ISBN: 978-3-319-55031-2

Electronic ISBN: 978-3-319-55032-9

Copyright Year: 2017

DOI
https://doi.org/10.1007/978-3-319-55032-9_1

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