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2017 | OriginalPaper | Buchkapitel

1. Introduction

verfasst von : Tamanna Alam, Poh-Seng Lee

Erschienen in: Flow Boiling in Expanding Microchannels

Verlag: Springer International Publishing

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Abstract

This chapter presents the need of flow boiling microscale heat sink cooling technique for thermal management in miniaturized electronic devices. The current understanding on this topic and the inhibiting factors associated with it (instabilities, hotspots) for practical applications are discussed. Potential methods, namely, expanding microgap, sloping fin microchannels, and stepped fin microchannels to mitigate drawbacks associated with flow boiling in microscale heat sinks, are highlighted. The aims and objectives of this brief are presented.

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Metadaten
Titel
Introduction
verfasst von
Tamanna Alam
Poh-Seng Lee
Copyright-Jahr
2017
DOI
https://doi.org/10.1007/978-3-319-55032-9_1

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