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Journal of Materials Science: Materials in Electronics

Published in:

05-01-2017

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Authors: Hélène Conseil-Gudla, Visweswara C. Gudla, Shruti Borgaonkar, Morten S. Jellesen, Rajan Ambat

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2017

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Abstract

Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed.

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Title: Investigation of moisture uptake into printed circuit board laminate and solder mask materials
Authors: Hélène Conseil-Gudla
Visweswara C. Gudla
Shruti Borgaonkar
Morten S. Jellesen
Rajan Ambat
Publication date: 05-01-2017
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 8/2017
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-016-6292-5

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