Issue 12/2004
Content (24 Articles)
Foreword
Srinivas Chada, Laura J. Turbini, Sung K. Kang, Kwang-Lung Lin, Michael R. Notis, Jin Yu
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
A. U. Telang, T. R. Bieler, J. P. Lucas, K. N. Subramanian, L. P. Lehman, Y. Xing, E. J. Cotts
Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints
C. M. Tsai, W. C. Luo, C. W. Chang, Y. C. Shieh, C. R. Kao
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
L. P. Lehman, S. N. Athavale, T. Z. Fullem, A. C. Giamis, R. K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, E. J. Cotts
The application of lead-free solder to optical fiber packaging
Shengquan Ou, Gu Xu, Yuhuan Xu, K. N. Tu
Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying
Szu-Tsung Kao, Jenq-Gong Duh
Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates
Mario F. Arenas, Viola L. Acoff
The effects of electroplating parameters on the composition and morphology of Sn-Ag solder
J. Y. Kim, J. Yu, J. H. Lee, T. Y. Lee
Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization
Zhong Chen, Min He, Guojun Qi
Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition
Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo
Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
I. E. Anderson, J. L. Harringa
Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate
Y. Qi, A. R. Zbrzezny, M. Agia, R. Lam, H. R. Ghorbani, P. Snugovsky, D. D. Perovic, J. K. Spelt
Effects of load and thermal conditions on Pb-free solder joint reliability
J. Liang, S. Downes, N. Dariavach, D. Shangguan, S. M. Heinrich
Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction
Gavin J. Jackson, Hua Lu, Raj Durairaj, Nick Hoo, Chris Bailey, Ndy N. Ekere, Jon Wright
Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging
Sang Won Jeong, Jong Hoon Kim, Hyuck Mo Lee
Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy
A. LaLonde, D. Emelander, J. Jeannette, C. Larson, W. Rietz, D. Swenson, D. W. Henderson
Interfacial reaction study on a solder joint with Sn-4Ag-0.5Cu solder ball and Sn-7Zn-Al (30 ppm) solder paste in a lead-free wafer level chip scale package
Huann-Wu Chiang, Jun-Yuan Chen, Jeffrey C. B. Lee, S. M. Li
Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate
Chih-Yao Liu, Moo-Chin Wang, Min-Hsiung Hon
The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate
Dae-Gon Kim, Seung-Boo Jung
A dynamic model for the assessment of the replacement of lead in solders
Markus A. Reuter, Ewoud V. Verhoef
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
Tia-Marje K. Korhonen, Pekka Turpeinen, Lawrence P. Lehman, Brian Bowman, George H. Thiel, Raymond C. Parkes, Mattt A. Korhonen, Donald W. Henderson, Karl J. Puttlitz
An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation
N. Chawla, Y. -L. Shen, X. Deng, E. S. Ege
Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
F. Ochoa, X. Deng, N. Chawla