Issue 6/2002
Content (14 Articles)
Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure
M. Yamashita, K. Suganuma
A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system
Jong Hoon Kim, Sang Won Jeong, Hyuck Mo Lee
Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder
Zhidong Xia, Zhigang Chen, Yaowu Shi, Nan Mu, Na Sun
A comparison of graphite and AlN caps used for annealing ion-implanted SiC
K. A. Jones, M. A. Derenge, P. B. Shah, T. S. Zheleva, M. H. Ervin, K. W. Kirchner, M. C. Wood, C. Thomas, M. G. Spencer, O. W. Holland, R. D. Vispute
Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering
Jong-Hyun Lee, Yong-Seog Kim
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
C. E. Ho, R. Y. Tsai, Y. L. Lin, C. R. Kao
Controlled vapor-pressure heat-treatment effect on deep levels in liquid-encapsulated czochralski-grown GaP crystals
T. J. Yu, T. Tanno, K. Suto, J. Nishizawa
Effects of alloying elements on cobalt silicide formation
C. Lavoie, C. Cabral Jr., F. M. d’Heurle, J. L. Jordan-Sweet, J. M. E. Harper
Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material
C. O. Jeong, N. S. Roh, S. G. Kim, H. S. Park, C. W. Kim, D. S. Sakong, J. H. Seok, K. H. Chung, W. H. Lee, Dongwen Gan, Paul S. Ho, B. S. Cho, B. J. Kang, H. J. Yang, Y. K. Ko, J. G. Lee
Optical and electrochromic properties of annealed lithium-molybdenum-bronze thin films
Zahid Hussain
Micro-raman investigation of the n-dopant distribution in lateral epitaxial overgrown GaN/sapphire (0001)
V. V. Chaldyshev, Fred H. Pollak, M. Pophristic, S. P. Gou, I. Ferguson
Fabrication of self-aligned graded junction termination extensions with applications to 4H-SiC P-N diodes
J. N. Merrett, T. Isaacs-Smith, D. C. Sheridan, J. R. Williams
Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions
T. H. Chuang, C. L. Yu, S. Y. Chang, S. S. Wang
Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials
Zongrong Liu, D. D. L. Chung