Issue 1/2009
Content (14 Articles)
Sintering mechanisms in aluminum nitride with Y or Ca-containing additive
A. L. Molisani, H. N. Yoshimura, H. Goldenstein
Thermally stable and low-resistance W/Ti/Au contacts to n-type GaN
V. Rajagopal Reddy, Sang-Ho Kim, Hyun-Gi Hong, Sang-Won Yoon, Jae-Pyoung Ahn, Tae-Yeon Seong
Effect of β-irradiation on photoluminescence of MOCVD grown GaN
Abdul Majid, M. Israr, Jianjun Zhu, Akbar Ali
Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test
Jong-Woong Kim, Young-Chul Lee, Sang-Su Ha, Seung-Boo Jung
Capacitance and resistance measurements of SnO2 thick-films
Miguel Adolfo Ponce, Miriam S. Castro, Celso M. Aldao
An alternative process for electroless copper plating on polyester fabric
R. H. Guo, S. Q. Jiang, C. W. M. Yuen, M. C. F. Ng
Microwave dielectric properties of 3Li2O–Nb2O5–3TiO2 ceramics with Li2O–V2O5 additions
Huanfu Zhou, Hong Wang, Xiaoyan Ding, Xi Yao
Studies of BaTiO3 thin films on different bottom electrode
Jun Wang, Tianjin Zhang, Junhuai Xiang, Wenkui Li, Shuwang Duo, Mingshen Li
The influence of area/volume ratio on microstructure and non-Ohmic properties of SnO2-based varistor ceramic blocks
M. A. Ramírez, J. F. Fernández, M. De la Rubia, J. de Frutos, P. R. Bueno, E. Longo, J. A. Varela
Stability of AuSn eutectic solder cap on Au socket during reflow
D. Q. Yu, H. Oppermann, J. Kleff, M. Hutter
Structural, optical, magnetic and electrical properties of Zn1−x Co x O thin films
M. Tay, Y. H. Wu, G. C. Han, Y. B. Chen, X. Q. Pan, S. J. Wang, P. Yang, Y. P. Feng
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications
V. N. Sekhar, T. C. Chai, S. Balakumar, Lu Shen, S. K. Sinha, A. A. O. Tay, Seung Wook Yoon
Electron beam induced second-harmonic generation in Er3+ doped PbO–GeO2 glasses containing silver nanoparticles
L. R. P. Kassab, R. Miedzinski, I. V. Kityk, J. Ebothe, D. M. da Silva, Ali H. Reshak