Laser sealing of organic light-emitting diode using low melting temperature glass frit

Glass frit encapsulation for laser-base sealing of the complex interiors results challenges for the electronics manufacturing process. The conventional frit packaging method relies on elevating thermal process by furnace where the package is heated to required temperature, hence limiting the use of temperature-sensitive materials and also creating problems in different packaging processes or multi-stage sealing products. In this paper, the benefits of combining novel laser-assist hermetical sealing and low temperature glass frit packaging are demonstrated and the technique offers a suitable and feasible solution. This frit of absorbent at specific laser wavelength is selected and applied as excellent contact with both large CTE range substrates. Glass frit composites consisting of a PbTiO₃ ceramic and the rare earth Nd₂O₃ are evaluated for thermal properties and electrical characteristics. This developed glass frit hermetical sealing method achieves moisture durability, satisfying the enculturation of electronics-level. In this paper, we demonstrate successfully using laser to seal organic light emitting diode (OLED) via low melting temperature glass frit.