Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 1/2015

01-01-2015

Low sintering temperature high permittivity ceramic composites for dielectric loaded microwave antennas

Authors: F. F. Gu, G. H. Chen, C. L. Yuan, C. R. Zhou, Y. Yang

Published in: Journal of Materials Science: Materials in Electronics | Issue 1/2015

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Compositions based on 0.2 Ca0.8Sr0.2TiO3–0.8Li0.5Sm0.5TiO3 (CST–LST), suitable for microwave applications were developed by adding BaCu (B2O5) additives and TiO2 dopant in order to tune the microwave dielectric properties and lower sintering temperature. Addition of BaCu (B2O5) lowered the firing temperature about 300 °C. A single solid solution phase with perovskite structure was formed through the entire compositions with BaCu (B2O5). The CST–LST ceramics with 5 wt% BaCu (B2O5) sintered at 950 °C exhibited the microwave dielectric properties of εr = 66.7, Q × f = 3,222 GHz, τ f  = −21.3 ppm/°C. Adding TiO2 also improved the microwave properties. Typically, the CST–LST + 5 wt% BaCu (B2O5) + 1.5 wt% TiO2 sintered at 950 °C showed εr = 71.6, Q × f = 3,441 GHz, τ f  = −10.8 ppm/°C. The high permittivity and low firing temperatures of BaCu (B2O5) added CST–LST ceramics with TiO2 dopant can be ideal for the development of low cost ultra-small dielectrically loaded antennas. Compatibility with Ag electrode indicated that this material was suitable for low temperature co-fired ceramics.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
1.
go back to reference M. Mirsaneh, I.M. Reaney, Y. Han, I. Sterianou, O.P. Leisten, Adv. Appl. Ceram. 110, 387 (2011)CrossRef M. Mirsaneh, I.M. Reaney, Y. Han, I. Sterianou, O.P. Leisten, Adv. Appl. Ceram. 110, 387 (2011)CrossRef
2.
3.
go back to reference M. Mirsaneh, O.P. Leisten, B. Zalinska, I.M. Reaney, Adv. Funct. Mater. 18, 2293 (2008)CrossRef M. Mirsaneh, O.P. Leisten, B. Zalinska, I.M. Reaney, Adv. Funct. Mater. 18, 2293 (2008)CrossRef
4.
go back to reference B. Tang, H. Li, S.Q. Yu, S.R. Zhang, J. Mater. Sci. Mater. EL. 24, 3551 (2013)CrossRef B. Tang, H. Li, S.Q. Yu, S.R. Zhang, J. Mater. Sci. Mater. EL. 24, 3551 (2013)CrossRef
6.
go back to reference A. Feteira, D. Iddles, T. Price, D. Muir, I.M. Reaney, J. Am. Ceram. Soc. 94, 817 (2011)CrossRef A. Feteira, D. Iddles, T. Price, D. Muir, I.M. Reaney, J. Am. Ceram. Soc. 94, 817 (2011)CrossRef
7.
go back to reference Y. Gu, J. Huang, Q. Li, D. Sun, H. Xu, J. Euro. Ceram. Soc. 28, 3149 (2008)CrossRef Y. Gu, J. Huang, Q. Li, D. Sun, H. Xu, J. Euro. Ceram. Soc. 28, 3149 (2008)CrossRef
8.
go back to reference R. Lowndes, F. Azough, R. Cernik, R. Freer, J. Euro. Ceram. Soc. 32, 3791 (2012)CrossRef R. Lowndes, F. Azough, R. Cernik, R. Freer, J. Euro. Ceram. Soc. 32, 3791 (2012)CrossRef
9.
go back to reference L. Zhang, X.M. Chen, N. Qin, X.Q. Liu, J. Euro. Ceram. Soc. 27, 3011 (2007)CrossRef L. Zhang, X.M. Chen, N. Qin, X.Q. Liu, J. Euro. Ceram. Soc. 27, 3011 (2007)CrossRef
10.
11.
12.
13.
go back to reference K. Ezaki, Y. Baba, H. Takahashi, K. Shibata, S. Nakano, Jpn. J. Appl. Phys. 32, 4319 (1993)CrossRef K. Ezaki, Y. Baba, H. Takahashi, K. Shibata, S. Nakano, Jpn. J. Appl. Phys. 32, 4319 (1993)CrossRef
15.
16.
17.
go back to reference K. Yan, N. Shiichi, T. Karaki, M. Adachi, Jpn. J. Appl. Phys. 47, 7721 (2008)CrossRef K. Yan, N. Shiichi, T. Karaki, M. Adachi, Jpn. J. Appl. Phys. 47, 7721 (2008)CrossRef
18.
19.
go back to reference J.B. Lim, K.H. Cho, S. Nahm, J.H. Paik, J.H. Kim, Mater. Res. Bull. 41, 1868 (2006)CrossRef J.B. Lim, K.H. Cho, S. Nahm, J.H. Paik, J.H. Kim, Mater. Res. Bull. 41, 1868 (2006)CrossRef
20.
21.
22.
go back to reference A. Templeton, X. Wang, S.J. Penn, S.J. Webb, L.F. Cohen, N.M. Alford, J. Am. Ceram. Soc. 83, 95 (2000)CrossRef A. Templeton, X. Wang, S.J. Penn, S.J. Webb, L.F. Cohen, N.M. Alford, J. Am. Ceram. Soc. 83, 95 (2000)CrossRef
24.
go back to reference P.K. Patro, A.R. Kulkarni, C.S. Harendranath, Mater. Res. Bull. 38, 249 (2003)CrossRef P.K. Patro, A.R. Kulkarni, C.S. Harendranath, Mater. Res. Bull. 38, 249 (2003)CrossRef
25.
26.
27.
go back to reference K. Yan, T. Karaki, M. Adachi, Jpn. J. Appl. Phys. 48, 09KE01-1 (2009) K. Yan, T. Karaki, M. Adachi, Jpn. J. Appl. Phys. 48, 09KE01-1 (2009)
28.
29.
go back to reference X.Y. Chen, W.J. Zhang, S.X. Bai, J. Mater. Sci.: Mater. Electron. 24(1), 224–229 (2013) X.Y. Chen, W.J. Zhang, S.X. Bai, J. Mater. Sci.: Mater. Electron. 24(1), 224–229 (2013)
Metadata
Title
Low sintering temperature high permittivity ceramic composites for dielectric loaded microwave antennas
Authors
F. F. Gu
G. H. Chen
C. L. Yuan
C. R. Zhou
Y. Yang
Publication date
01-01-2015
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 1/2015
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2408-y

Other articles of this Issue 1/2015

Journal of Materials Science: Materials in Electronics 1/2015 Go to the issue