Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 6/2016

22-02-2016

Manufacture and dielectric properties of X9R Bi-based lead-free multilayer ceramic capacitors with AgPd inner electrodes

Authors: Cong Su, Hua Hao, Qi Xu, Yangyang Lu, Millicent Appiah, Chunli Diao, Minghe Cao, Zhonghua Yao, Hanxing Liu

Published in: Journal of Materials Science: Materials in Electronics | Issue 6/2016

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

In this paper, 0.6(Na0.5Bi0.5)TiO3–0.4NaNbO3(0.6NBT–0.4NN) was synthesized by solid state reaction method. The homogenous green ceramic sheets with high density were produced by tape casting according to suitable casting parameters. Embryos of multilayered ceramic capacitors (MLCC) had been fabricated by punching, screen printing, stacking, laminating and cutting processes. And then after burning out and sintering at different conditions, the cross-sectional microstructures of components were compared. Differential scanning calorimetric analysis and the thermo-gravimetric analysis of green devices were carried out to analyze the effects of different sintering procedures on MLCCs. The dielectric properties and polarization loops of the MLCCs were investigated with dielectric constant (800–895), dielectric loss (0.004–0.007) and capacitance variation ΔC/C < 11 % in the temperature range of −55 to 205 °C, which satisfied X9R in the Electronic Industries Association standard. The breakdown strength of the capacitor was 260 kV/cm. The resistance of the capacitor was measured to be 1.873 × 1011 Ω. These properties of the 0.6NBT–0.4NN ceramic capacitor indicated the potential dielectric materials for the application of MLCCs at the high temperature.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
2.
go back to reference R.W. Johnson, J.L. Evans, P. Jacobsen, J.R. Thompson, M. Christopher, Electr. Packag. Manuf. IEEE Trans. on 27, 164 (2004)CrossRef R.W. Johnson, J.L. Evans, P. Jacobsen, J.R. Thompson, M. Christopher, Electr. Packag. Manuf. IEEE Trans. on 27, 164 (2004)CrossRef
3.
go back to reference L.X. Li, M.J. Wang, Y.R. Liu, J.X. Chen, N. Zhang, Ceram Int. 40, 1105 (2014)CrossRef L.X. Li, M.J. Wang, Y.R. Liu, J.X. Chen, N. Zhang, Ceram Int. 40, 1105 (2014)CrossRef
4.
go back to reference Y.M. Li, W. Chen, J. Zhou, Q. Xu, H.J. Sun, R.X. Xu, Mater. Sci. Eng. B 112, 5 (2004)CrossRef Y.M. Li, W. Chen, J. Zhou, Q. Xu, H.J. Sun, R.X. Xu, Mater. Sci. Eng. B 112, 5 (2004)CrossRef
5.
6.
go back to reference Y.M. Chiang, G.W. Farrey, A.N. Soukhojak, Appl. Phys. Lett. 73, 3683 (1998)CrossRef Y.M. Chiang, G.W. Farrey, A.N. Soukhojak, Appl. Phys. Lett. 73, 3683 (1998)CrossRef
7.
8.
go back to reference O. Elkechai, P. Marchet, P. Thomas, M. Manier, J.P. Mercurio, J. Mater. Chem. 7, 91 (1997)CrossRef O. Elkechai, P. Marchet, P. Thomas, M. Manier, J.P. Mercurio, J. Mater. Chem. 7, 91 (1997)CrossRef
12.
13.
go back to reference T. Wada, K. Toyoike, Y. Imanaka, Y. Matsuo, Jpn. J. Appl. Phys. 40, 5703 (2001)CrossRef T. Wada, K. Toyoike, Y. Imanaka, Y. Matsuo, Jpn. J. Appl. Phys. 40, 5703 (2001)CrossRef
14.
go back to reference Q. Xu, Z. Song, W. Tang, H. Hao, L. Zhang, M. Appiah, M.H. Cao, Z.H. Yao, Z.C. He, H.X. Liu, J. Am. Ceram. Soc. 98, 3119 (2015)CrossRef Q. Xu, Z. Song, W. Tang, H. Hao, L. Zhang, M. Appiah, M.H. Cao, Z.H. Yao, Z.C. He, H.X. Liu, J. Am. Ceram. Soc. 98, 3119 (2015)CrossRef
15.
go back to reference Y.K. Kim, Y.G. Jung, T.H. Sung, D.H. Kim, U. Paik, J. Mater. Process. Technol. 152, 276 (2004)CrossRef Y.K. Kim, Y.G. Jung, T.H. Sung, D.H. Kim, U. Paik, J. Mater. Process. Technol. 152, 276 (2004)CrossRef
16.
go back to reference J.G. Pepin, W. Borland, P. O’Callaghan, J.S. Richard, Young J. Am. Ceram. Soc. 72, 2287 (1989)CrossRef J.G. Pepin, W. Borland, P. O’Callaghan, J.S. Richard, Young J. Am. Ceram. Soc. 72, 2287 (1989)CrossRef
18.
go back to reference R.E. Mistler, E.R. Twiname, Tape Casting: Theory and Practice (American Ceramic Society, Westerville, 2000), pp. 128–159 R.E. Mistler, E.R. Twiname, Tape Casting: Theory and Practice (American Ceramic Society, Westerville, 2000), pp. 128–159
19.
go back to reference C.C. Wu, Y.H. Lin, P.S. Cheng, C.C. Chan, C.F. Yang, Adv. Mater. Res. 415, 1064 (2012) C.C. Wu, Y.H. Lin, P.S. Cheng, C.C. Chan, C.F. Yang, Adv. Mater. Res. 415, 1064 (2012)
21.
go back to reference Q. Xu, T.M. Li, H. Hao, S.J. Zhang, Z.J. Wang, M.H. Cao, Z.H. Yao, H.X. Liu, J. Eur. Ceram. Soc. 35, 545 (2015)CrossRef Q. Xu, T.M. Li, H. Hao, S.J. Zhang, Z.J. Wang, M.H. Cao, Z.H. Yao, H.X. Liu, J. Eur. Ceram. Soc. 35, 545 (2015)CrossRef
22.
go back to reference L.J. Liu, Z. Yang, M.X. Wu, L. Fang, C.Z. Hu, J. Alloys Compd. 507, 196 (2010)CrossRef L.J. Liu, Z. Yang, M.X. Wu, L. Fang, C.Z. Hu, J. Alloys Compd. 507, 196 (2010)CrossRef
23.
go back to reference Y.M. Huang, D.P. Shi, L.J. Liu, G.Z. Li, S.Y. Zheng, L. Fang, Appl. Phys. A 114, 891 (2014)CrossRef Y.M. Huang, D.P. Shi, L.J. Liu, G.Z. Li, S.Y. Zheng, L. Fang, Appl. Phys. A 114, 891 (2014)CrossRef
24.
go back to reference L.J. Liu, Y.M. Huang, C.X. Su, L. Fang, M.X. Wu, C.Z. Hu, H.Q. Fan, Appl. Phys. A Mater. Sci. Process. 104, 1047 (2011)CrossRef L.J. Liu, Y.M. Huang, C.X. Su, L. Fang, M.X. Wu, C.Z. Hu, H.Q. Fan, Appl. Phys. A Mater. Sci. Process. 104, 1047 (2011)CrossRef
25.
Metadata
Title
Manufacture and dielectric properties of X9R Bi-based lead-free multilayer ceramic capacitors with AgPd inner electrodes
Authors
Cong Su
Hua Hao
Qi Xu
Yangyang Lu
Millicent Appiah
Chunli Diao
Minghe Cao
Zhonghua Yao
Hanxing Liu
Publication date
22-02-2016
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 6/2016
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-4541-2

Other articles of this Issue 6/2016

Journal of Materials Science: Materials in Electronics 6/2016 Go to the issue