2009 | OriginalPaper | Chapter
Measurements for Mechanical Reliability of Thin Films
Authors : David T. Read, Alex A. Volinsky
Published in: Security and Reliability of Damaged Structures and Defective Materials
Publisher: Springer Netherlands
Activate our intelligent search to find suitable subject content or patents.
Select sections of text to find matching patents with Artificial Intelligence. powered by
Select sections of text to find additional relevant content using AI-assisted search. powered by
This paper reviews techniques for measurement of basic mechanical properties of thin films. Emphasis is placed on the adaptations needed to prepare, handle, and characterize thin films, and on adaptations of fracture mechanics for adhesion strength. The paper also describes a recent development, the use of electrical current as a controlled means of applying thermo-mechanical stresses to electrical conductors to characterize their fatigue behavior.