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Published in: Microsystem Technologies 10/2019

14-06-2019 | Technical Paper

Metamodel assisted evolution strategies for global optimization of solder joints reliability in embedded mechatronic devices

Authors: Hamid Hamdani, Bouchaïb Radi, Abdelkhalak El Hami

Published in: Microsystem Technologies | Issue 10/2019

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Abstract

This paper proposes a Kriging assisted covariance matrix adaptation evolution strategy (AK-CMA-ES) for optimization of mechatronics device structures. The objective of the proposed method is to design reliable structures with reduced computational cost of the multiphysics finite element simulation. The Finite element model intends to analyze the sequence of failure events in mechatronic devices. This numerical model is used to estimate the thermal cycles to failure. Subsequently, the AK-CMA-ES optimization process is performed in order to improve the performance of structural design of mechatronic systems and to find the best designs with safety and reasonable computational costs. The proposed method couple the kriging metamodel with the covariance matrix adaptation evolution strategy (CMA-ES). Kriging metamodel is used to replace the finite element simulation in order to overcome the computational cost of finite element model simulation. Kriging is used together with CMA-ES and sequentially updated and its quality is measured according to its ability in the ranking of the population through approximate ranking procedure (ARP). The application of this method in the optimization of mechatronic systems proves its efficiency and ability to improve the performance of mechatronic systems with avoiding the problem of tedious computation.

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Literature
go back to reference Anand L (1982) Constitutive equations for the rate-dependent deformation of metals at elevated temperatures. J Eng Mater Technol Trans ASME 104(1):12–17CrossRef Anand L (1982) Constitutive equations for the rate-dependent deformation of metals at elevated temperatures. J Eng Mater Technol Trans ASME 104(1):12–17CrossRef
go back to reference Aoues Y, Makhloufi A, Pougnet P, El Hami A (2012) Probabilistic assessment of thermal fatigue of solder joints in mechatronic packaging. In: Proceedings of the 1st international symposium on uncertainty quantification and stochastic modeling, Maresias, SP Aoues Y, Makhloufi A, Pougnet P, El Hami A (2012) Probabilistic assessment of thermal fatigue of solder joints in mechatronic packaging. In: Proceedings of the 1st international symposium on uncertainty quantification and stochastic modeling, Maresias, SP
go back to reference Bäck T, Foussette C, Krause P (2013) Contemporary evolution strategies. Springer, New YorkCrossRefMATH Bäck T, Foussette C, Krause P (2013) Contemporary evolution strategies. Springer, New YorkCrossRefMATH
go back to reference Branke J, Schmidt C (2005) Faster convergence by means of fitness estimation. Soft computing-A fusion of foundations, methodologies and applications 9(1):13–20 Branke J, Schmidt C (2005) Faster convergence by means of fitness estimation. Soft computing-A fusion of foundations, methodologies and applications 9(1):13–20
go back to reference El Hami A, Pougnet P (2015) Embedded mechatronic systems, vol 2. Elsevier, Amsterdam El Hami A, Pougnet P (2015) Embedded mechatronic systems, vol 2. Elsevier, Amsterdam
go back to reference El Hami A, Radi B (2011) Comparison study of different reliability-based design optimization approaches. In: Advanced materials research, vol 274, pp 113–121. Trans Tech Publ El Hami A, Radi B (2011) Comparison study of different reliability-based design optimization approaches. In: Advanced materials research, vol 274, pp 113–121. Trans Tech Publ
go back to reference El Hami A, Radi B (2013) Uncertainty and optimization in structural mechanics. Wiley, AmsterdamCrossRef El Hami A, Radi B (2013) Uncertainty and optimization in structural mechanics. Wiley, AmsterdamCrossRef
go back to reference El Maani R, Makhloufi A, Radi B, El Hami A (2018) Reliability-based design optimization with frequency constraints using a new safest point approach. Eng Optim 50(10):1715–1732MathSciNetCrossRef El Maani R, Makhloufi A, Radi B, El Hami A (2018) Reliability-based design optimization with frequency constraints using a new safest point approach. Eng Optim 50(10):1715–1732MathSciNetCrossRef
go back to reference Grieu M (2010) Étude de la fatigue des joints brasés de composants électroniques soumis á des sollicitations thermomécaniques, vibratoires et combinées. PhD thesis, École Nationale Supérieure des Mines de Paris Grieu M (2010) Étude de la fatigue des joints brasés de composants électroniques soumis á des sollicitations thermomécaniques, vibratoires et combinées. PhD thesis, École Nationale Supérieure des Mines de Paris
go back to reference Guide A (2015) ANSYS structural analysis guide Guide A (2015) ANSYS structural analysis guide
go back to reference Hamdani H, Radi B, El Hami A (2017) Métamodélisation pour une conception robuste des systèmes mécatroniques. Incertitudes et fiabilité des systèmes multiphysiques 2(Numéro 2):10 Hamdani H, Radi B, El Hami A (2017) Métamodélisation pour une conception robuste des systèmes mécatroniques. Incertitudes et fiabilité des systèmes multiphysiques 2(Numéro 2):10
go back to reference Hossain MM, Jagarkal SG, Agonafer D, Lulu M, Reh S (2007) Design optimization and reliability of PWB level electronic package. J Electron Packag 129(1):9–18CrossRef Hossain MM, Jagarkal SG, Agonafer D, Lulu M, Reh S (2007) Design optimization and reliability of PWB level electronic package. J Electron Packag 129(1):9–18CrossRef
go back to reference Huang C (2017) Kriging-assisted evolution strategy for optimization and application in material parameters identification. PhD thesis, Rouen, INSA Huang C (2017) Kriging-assisted evolution strategy for optimization and application in material parameters identification. PhD thesis, Rouen, INSA
go back to reference Huang C, Radi B, El Hami A, Bai H (2018) CMA evolution strategy assisted by kriging model and approximate ranking. Appl Intell 48(11):4288–4304CrossRef Huang C, Radi B, El Hami A, Bai H (2018) CMA evolution strategy assisted by kriging model and approximate ranking. Appl Intell 48(11):4288–4304CrossRef
go back to reference Jannoun M, Aoues Y, Pagnacco E, Pougnet P, El-Hami A (2017) Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration. Microelectron Reliab 78:249–257CrossRef Jannoun M, Aoues Y, Pagnacco E, Pougnet P, El-Hami A (2017) Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration. Microelectron Reliab 78:249–257CrossRef
go back to reference JEDEC Standard (2000) Temperature cycling, JESD22-A104-B. JEDEC Solid state technology association, July 2000 JEDEC Standard (2000) Temperature cycling, JESD22-A104-B. JEDEC Solid state technology association, July 2000
go back to reference Jin Y (2005) A comprehensive survey of fitness approximation in evolutionary computation. Soft Comput A Fusion Found Methodol Appl 9(1):3–12 Jin Y (2005) A comprehensive survey of fitness approximation in evolutionary computation. Soft Comput A Fusion Found Methodol Appl 9(1):3–12
go back to reference Jin Y (2011) Surrogate-assisted evolutionary computation: recent advances and future challenges. Swarm Evolut Comput 1(2):61–70CrossRef Jin Y (2011) Surrogate-assisted evolutionary computation: recent advances and future challenges. Swarm Evolut Comput 1(2):61–70CrossRef
go back to reference Jin Y, Hüsken M, Sendhoff B (2003) Quality measures for approximate models in evolutionary computation. GECCO, pp 170–173 Jin Y, Hüsken M, Sendhoff B (2003) Quality measures for approximate models in evolutionary computation. GECCO, pp 170–173
go back to reference Jin Y, Olhofer M, Sendhoff B (2000) On evolutionary optimization with approximate fitness functions. In: Proceedings of the 2nd annual conference on genetic and evolutionary computation, Morgan Kaufmann Publishers Inc, Burlington, pp 786–793 Jin Y, Olhofer M, Sendhoff B (2000) On evolutionary optimization with approximate fitness functions. In: Proceedings of the 2nd annual conference on genetic and evolutionary computation, Morgan Kaufmann Publishers Inc, Burlington, pp 786–793
go back to reference Jin Y, Sendhoff B (2002) Fitness approximation in evolutionary computation-a survey. In: Proceedings of the 4th annual conference on genetic and evolutionary computation, Morgan Kaufmann Publishers Inc, Burlington, pp 1105–1112 Jin Y, Sendhoff B (2002) Fitness approximation in evolutionary computation-a survey. In: Proceedings of the 4th annual conference on genetic and evolutionary computation, Morgan Kaufmann Publishers Inc, Burlington, pp 1105–1112
go back to reference Kanchanomai C, Miyashita Y, Mutoh Y (2002a) Low cycle fatigue behavior and mechanisms of a eutectic sn–pb solder 63sn/37pb. Int J Fatig 24(6):671–683CrossRef Kanchanomai C, Miyashita Y, Mutoh Y (2002a) Low cycle fatigue behavior and mechanisms of a eutectic sn–pb solder 63sn/37pb. Int J Fatig 24(6):671–683CrossRef
go back to reference Kanchanomai C, Miyashita Y, Mutoh Y (2002b) Low-cycle fatigue behavior of sn–ag, sn–ag–cu, and sn–ag–cu–bi lead-free solders. J Electron Mater 31(5):456–465CrossRef Kanchanomai C, Miyashita Y, Mutoh Y (2002b) Low-cycle fatigue behavior of sn–ag, sn–ag–cu, and sn–ag–cu–bi lead-free solders. J Electron Mater 31(5):456–465CrossRef
go back to reference Kern S, Hansen N, Koumoutsakos P (2006) Local meta-models for optimization using evolution strategies. In: PPSN, Springer, New York, pp 939–948 Kern S, Hansen N, Koumoutsakos P (2006) Local meta-models for optimization using evolution strategies. In: PPSN, Springer, New York, pp 939–948
go back to reference Kramer O (2014) A brief introduction to continuous evolutionary optimization. Springer, New YorkCrossRefMATH Kramer O (2014) A brief introduction to continuous evolutionary optimization. Springer, New YorkCrossRefMATH
go back to reference Krige DG (1951) A statistical approach to some basic mine valuation problems on the witwatersrand. J S Afr Inst Min Metall 52(6):119–139 Krige DG (1951) A statistical approach to some basic mine valuation problems on the witwatersrand. J S Afr Inst Min Metall 52(6):119–139
go back to reference Lee W, Nguyen L, Selvaduray GS (2000) Solder joint fatigue models: review and applicability to chip scale packages. Microelectron Reliab 40(2):231–244CrossRef Lee W, Nguyen L, Selvaduray GS (2000) Solder joint fatigue models: review and applicability to chip scale packages. Microelectron Reliab 40(2):231–244CrossRef
go back to reference Makhloufi A, Aoues Y, El Hami A (2016) Reliability based design optimization of wire bonding in power microelectronic devices. Microsyst Technol 22(12):2737–2748CrossRef Makhloufi A, Aoues Y, El Hami A (2016) Reliability based design optimization of wire bonding in power microelectronic devices. Microsyst Technol 22(12):2737–2748CrossRef
go back to reference Nubli Zulkifli M, Jamal Azhar Zahid Z, Abdul Quadir G (2011) Temperature cycling analysis for ball grid array package using finite element analysis. Microelectron Int 28(1):17–28CrossRef Nubli Zulkifli M, Jamal Azhar Zahid Z, Abdul Quadir G (2011) Temperature cycling analysis for ball grid array package using finite element analysis. Microelectron Int 28(1):17–28CrossRef
go back to reference Rasmussen CE, Williams CK (2006) Gaussian processes for machine learning, vol 1. MIT Press, CambridgeMATH Rasmussen CE, Williams CK (2006) Gaussian processes for machine learning, vol 1. MIT Press, CambridgeMATH
go back to reference Rencher AC (2003) Methods of multivariate analysis, vol 492. Wiley, AmsterdamMATH Rencher AC (2003) Methods of multivariate analysis, vol 492. Wiley, AmsterdamMATH
go back to reference Runarsson TP (2004) Constrained evolutionary optimization by approximate ranking and surrogate models. In: International conference on parallel problem solving from nature, Springer, New York, pp 401–410 Runarsson TP (2004) Constrained evolutionary optimization by approximate ranking and surrogate models. In: International conference on parallel problem solving from nature, Springer, New York, pp 401–410
go back to reference Saadoune N, Radi B (2016) Probabilistic study of an embedded system. In: Information Science and Technology (CiSt), 2016 4th IEEE International Colloquium, IEEE, pp 756–761 Saadoune N, Radi B (2016) Probabilistic study of an embedded system. In: Information Science and Technology (CiSt), 2016 4th IEEE International Colloquium, IEEE, pp 756–761
go back to reference Van Driel W, Hochstenbach H, Zhang G (2006) Design for reliability of wafer level packages. In: Thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, 2006. EuroSime 2006, 7th international conference on, IEEE, pp 1–6 Van Driel W, Hochstenbach H, Zhang G (2006) Design for reliability of wafer level packages. In: Thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems, 2006. EuroSime 2006, 7th international conference on, IEEE, pp 1–6
go back to reference Wang G, Cheng Z, Becker K, Wilde J (2001) Applying anand model to represent the viscoplastic deformation behavior of solder alloys. J Electron Packaging 123(3):247–253CrossRef Wang G, Cheng Z, Becker K, Wilde J (2001) Applying anand model to represent the viscoplastic deformation behavior of solder alloys. J Electron Packaging 123(3):247–253CrossRef
Metadata
Title
Metamodel assisted evolution strategies for global optimization of solder joints reliability in embedded mechatronic devices
Authors
Hamid Hamdani
Bouchaïb Radi
Abdelkhalak El Hami
Publication date
14-06-2019
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 10/2019
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-019-04520-1

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