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Microsystem Technologies
Published in: Microsystem Technologies 10-11/2006

01-09-2006 | Technical paper

Micromachined silicon via-holes and interdigital bandpass filters

Authors: Jian Zhu, Yuanwei Yu, Naibin Yang, Bailing Zhou, Yong Zhang

Published in: Microsystem Technologies | Issue 10-11/2006

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Abstract

Several through-silicon-substrate-via-holes used in microwave circuits are analyzed. The silicon via-holes have been fabricated by inductively coupled plasma (ICP) process. Using via-holes for microstrip transmission lines, a micromachined Ku-band interdigital filter has been designed, fabricated, and tested. It achieved an insertion loss of −2.4 dB, and a 3 dB fractional bandwidth of 8%. This filter has the advantages of small sizes and relatively outstanding RF performance.
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Literature
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Metadata
Title
Micromachined silicon via-holes and interdigital bandpass filters
Authors
Jian Zhu
Yuanwei Yu
Naibin Yang
Bailing Zhou
Yong Zhang
Publication date
01-09-2006
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 10-11/2006
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0122-2

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