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Journal of Materials Engineering and Performance
Published in: Journal of Materials Engineering and Performance 5/2008

01-10-2008

Microstructural Characterization of TLPD bonded 6061-SiCp Composite

Authors: Joydeep Maity, Tapan K. Pal, Rabindranath Maiti

Published in: Journal of Materials Engineering and Performance | Issue 5/2008

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Abstract

Microstructural development during transient liquid phase diffusion (TLPD) bonding of extruded aluminum-based metal matrix composite (6061-15 wt.% SiCp) using 50-μm-thick copper interlayer was investigated by optical microscopy, scanning electron microscopy (SEM) together with SEM-based energy dispersive x-ray spectroscopy (EDS). Microstructural changes in the joint region were examined for a bonding temperature of 560 °C with five different holding time (20 min, 1 h, 2 h, 3 h, and 6 h) under two different applied pressure (0.1 and 0.2 MPa). Kinetics of the bonding process was significantly accelerated in presence of reinforcement (SiC). This acceleration is attributed to the increased solute diffusivity through defects as well as decreased incubation time required for nucleation (SiC particles acting as nucleating agent).
previous article Effect of the Current Density on Morphology, Porosity, and Tribological Properties of Electrodeposited Nickel on Copper
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Metadata
Title
Microstructural Characterization of TLPD bonded 6061-SiCp Composite
Authors
Joydeep Maity
Tapan K. Pal
Rabindranath Maiti
Publication date
01-10-2008
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 5/2008
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-008-9211-y

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