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Microsystem Technologies
Published in: Microsystem Technologies 5/2017

18-12-2015 | Technical Paper

Modeling and analysis of MEMS capacitive differential pressure sensor structure for altimeter application

Authors: Eswaran Parthasarathy, Malarvizhi S

Published in: Microsystem Technologies | Issue 5/2017

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Abstract

This paper presents the capacitive differential pressure sensor (CDPS) structure modeling, diaphragm material selection for CDPS and the analysis on deflection and capacitive sensitivity. Principle of CDPS was explained for the proposed model, whereas earlier works reports on absolute pressure sensing techniques. Simple and sandwich diaphragm structure for the CDPS was also proposed and its deflection characteristics was analyzed. Five different CDPS structure was modeled ranging from simple to complex structure. Simulation was carried out for the differential pressure range from −56 mbar to 900 mbar, used to study centre deflection sensitivity and capacitive sensitivity for the proposed CDPS structure models for altimeter application. From the simulation results it was observed, that model 3-high sensitive CDPS structure with polyimide sandwich diaphragm structure meets the desired requirement and shows center deflection sensitivity of 148.4 nm/mbar and capacitive sensitivity of 0.574 fF/mbar.
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Literature
Abhijeet V et al (2001) Batch processing of vacuum sealed capacitive pressure sensor. J Microelectromech Syst 10(4):580–588CrossRef
Duck B et al (2003) Design and simulation of MEMS based comb drive pressure sensor for pediatric postoperative monitoring application. In: 2003 summer bioengineering conference, Florida, pp 1239–1240
Eswaran P, Malarvizhi S (2012a) Simulation analysis of MEMS based capacitive differential pressure sensor for aircraft application. Adv Mater Res 403–408(2012):4152–4156
Eswaran P, Malarvizhi S (2012b) Modeling of MEMS capacitive differential pressure sensor. In: IEEE international conference on circuits, power and computing technologies (ICCPCT-2013), Noorul Islam University, Kanyakumari, India, 21st and 22nd March 2013, pp 699–702
Eswaran P, Malarvizhi S (2012c) Design analysis of MEMS capacitive differential pressure sensor for aircraft altimeter. Int J Appl Phys Math 2(1):14–20CrossRef
Eswaran P, Malarvizhi S (2012d) Sensitivity analysis on MEMS capacitive differential pressure sensor with bossed diaphragm membrane. In: IEEE international conference on devices, circuits and systems (ICDCS), Karunya University, Coimbatore, India, 15th and 16th March, pp 705–709
Eswaran P, Malarvizhi S (2013a) MEMS capacitive pressure sensors: a review on recent development and prospective. Int J Eng Technol 5(3):2734–2746
Eswaran P, Malarvizhi S (2013b) Modeling and analysis of high sensitive MEMS capacitive differential pressure sensor with polyimide diaphragm. Adv Sci Lett 19(12):3449–3453CrossRef
Han J et al (2009) Smooth contact capacitive pressure sensors in touch- and peeling-mode operation. IEEE Sens J 9(3):199–209CrossRef
Jithendra N et al (2006) MEMS-capacitive pressure sensor fabricated using printed-circuit-processing techniques. IEEE Sens J 6(6):1374–1375CrossRef
Ko WH, Wang Q (1999) Touch mode capacitive pressure sensors. Sens Actuators A 75:242–251CrossRef
Lee Y et al (1982) A batch-fabricated silicon capacitive pressure transducer with low temperature sensitivity. IEEE Trans Electron Dev 29(1):42–48CrossRef
Liu C (2012) Foundation of MEMS. Pearson Education Limited, India, 2nd edition, Chap 13
Okojie RS et al (1997) Operation of a (6H)-SiC pressure sensor at 500 C. In: Proceedings of international conference on solid-state sensors and actuators, pp 1407–1409
Po-Jui C et al (2008) Microfabricated implantable parylene-based wireless passive intraocular pressure sensors. J Microelectromech Syst 17(6):1342–1351CrossRef
Sung-Pil C et al (2005) Demonstration for integrating capacitive pressure sensors with read-out circuitry on stainless steel substrate. Sens Actuators A 116:195–204
Wang Q, Ko WH (1999) Modeling of touch mode capacitive sensors and diaphragms. Sens Actuators A 75:230–241CrossRef
Xuefeng W et al (2001) Micromachining techniques for liquid crystal polymer. In: Proceedings of 14th IEEE international conference on microelectromechanical system, Interlaken, Switzerland, pp 1–5
Zhang Y et al (2011) A high-sensitive ultra thin MEMS capacitive pressure sensor. In: Proceedings of 16th international conference on solid state sensors, actuators and microsystems conference (Transducers), China, pp 112–115
Zhou M-X et al (2005) Modeling, design and fabrication of a triple-layered capacitive pressure sensor. Sens Actuators A 117:71–81CrossRef
Metadata
Title
Modeling and analysis of MEMS capacitive differential pressure sensor structure for altimeter application
Authors
Eswaran Parthasarathy
Malarvizhi S
Publication date
18-12-2015
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 5/2017
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2756-4

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