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Journal of Electronic Materials
Published in: Journal of Electronic Materials 1/2006

01-01-2006

Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

Authors: M. L. Huang, T. Loeher, D. Manessis, L. Boettcher, A. Ostmann, H. Reichl

Published in: Journal of Electronic Materials | Issue 1/2006

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previous article Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires
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Metadata
Title
Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Authors
M. L. Huang
T. Loeher
D. Manessis
L. Boettcher
A. Ostmann
H. Reichl
Publication date
01-01-2006
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 1/2006
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-006-0202-1

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Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires

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Effect of KOH treatment on the schottky barrier height and reverse leakage current in Pt/n-GaN

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