Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Journal of Materials Engineering and Performance
Published in: Journal of Materials Engineering and Performance 4/2013

01-04-2013

Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications

Authors: Sabuj Mallik, Erica Hiu Laam Chan, Ndy Ekere

Published in: Journal of Materials Engineering and Performance | Issue 4/2013

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Sn-Ag-Cu solder pastes are widely used as the joining material in the electronic assembly process. The aim of this work was to evaluate the nonlinear viscoelastic behaviors of three different Sn-Ag-Cu solder pastes. Three novel rheological test methods were developed for this purpose. These include viscosity, thixotropic loop, and oscillatory amplitude sweep tests. The nonlinear flow curves obtained from the viscosity tests revealed the “shear-thinning” behavior of solder paste samples. Thixotropic loop test results explain the time-dependent structural breakdown and recovery of solder pastes. The viscoelastic properties of solder pastes were interpreted through oscillatory test parameters: storage modulus (G′), loss modulus (G″), and phase angle (δ). The discrepancies observed in the rheological behaviors of the paste samples were found to be related with flux composition (liquid phase in the solder paste) and particle size distribution.
previous article An Experiment on Magnetic Pulse Uniaxial Tension of AZ31 Magnesium Alloy Sheet at Room Temperature
next article Microstructure and Properties of Cast B-Bearing High Speed Steel

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Literature
1.
R. Lapasin, V. Sritori, and D. Casati, Rheological Characterisation of Solder Pastes, J. Electron. Mater., 1994, 23, p 525–532CrossRef
2.
R. Durairaj, S. Ramesh, S. Mallik, A. Seman, and N. Ekere, Rheological Characterisation and Printing Performance of Sn/Ag/Cu Solder Pastes, J. Mater. Des., 2009, 30, p 3812–3818CrossRef
3.
S. Mallik, “Study of the Time-dependent Rheological Behaviour of Lead-Free Solder Pastes and Flux Medium Used for Flip-Chip Assembly Applications”, Ph.D. Thesis, 2009, University of Greenwich
4.
T. Okuru, et al., Optimisation of Solder Pate Printability with Laser Inspection Technique, Proc IEEE/CPMT International Electronics Manufacturing Symposium, 1993, p 57–161
5.
R. Durairaj et al., Solder Paste Characterisation: Towards the Development of Quality Control (QC) Tool, J. Solder Surf. Mount Technol., 2008, 10, p 33–40
6.
S. Mallik et al., Wall-Slip Effects in SnAgCu Solder Pastes Used in Electronics Assembly Applications, J. Mater. Des., 2009, 30, p 4502–4506CrossRef
7.
R. Durairaj, et al., Viscoelastic Properties of Solder Pastes and Isotropic Conductive Adhesives Used for Flip-Chip Assembly, 33rd International Electronics Manufacturing Technology Conference (IEMT), Malaysia, 2008
8.
S. Mallik, et al., Study of the Rheological Behaviours of Sn-Ag-Cu Solder Pastes and Their Correlation with Printing Performance, 11th Electronics Packaging Technology Conference (EPTC 2009), 9-11 Dec 2009, Singapore, p 869–874
9.
R. Durairaj, et al., Rheological Characterisation of New Lead-Free Solder Paste Formulations for Flip-Chip Assembly, 1st Electronics System Integration Technology Conference, 2006, Dresden, Germany, p 995–1000
10.
M.A. Currie, “Characterisation of Solder Pastes Used in Reflow Soldering of Surface Mount Assembly”, Ph.D. Thesis, University of Salford, UK, 1997
11.
J.S. Hwang, Solder Paste in Electronics Packaging, Van Nostrand Reinhold, New York, 1989CrossRef
12.
S. Fujiuchi, Lead-Free Solder Paste and Reflow Soldering, Lead-Free Soldering in Electronics—Science, Technology and Environmental Impact, K. Suganuma, Ed., Marcel Dekker, Inc., New York, 2004, p 243–270
13.
K. Nimmo, Alloy Selections, Lead-Free Soldering in Electronics—Science, Technology and Environmental Impact, K. Suganuma, Ed., Marcel Dekker, Inc., New York, 2004, p 49–90
14.
C. Handwerker, U. Kattner, K. Moon, Materials Science Concepts in Lead-Free Soldering, Lead-Free Soldering in Electronics—Science, Technology and Environmental Impact, Marcel Dekker, Inc., New York, 2004, p 19–48
15.
16.
M. Pecht, Soldering Processes and Equipments, John Wiley and Sons, New York, 1993, p 22–25
17.
R. Prasad, Surface Mount Technology: Principles and Practices, Springer, New York, 1997CrossRef
18.
G.J. Jackson, R. Durairaj, and N.N. Ekere, Characterisation of Lead-Free Solder Pastes for Low Cost Flip-chip Bumping, 27th IEEE/SEMI International Electronic Manufacturing Technology Symposium, 2002, p 223–228
19.
S. Mallik, N.N. Ekere, R. Durairaj, and A.E. Marks, An Investigation into the Rheological Properties of Different Lead-Free Solder Pastes for Surface Mount Applications, Solder. Surf. Mount Technol., 2008, 20(2), p 3–10CrossRef
20.
H.A. Barnes, A Review of the Slip (Wall Depletion) of Polymer Solutions, Emulsions and Particle Suspensions in Viscometers: Its Cause, Character and Cure, J. Nonnewton. Fluid Mech., 1995, 56, p 221–251CrossRef
21.
H.A. Barnes, Thixotropy—A Review, J. Nonnewton. Fluid Mech., 1997, 70, p 1–33CrossRef
22.
J. Ferguson and Z. Kemblowski, Applied Fluid Rheology, Elsvier Applied Science, New York, 1991
Metadata
Title
Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications
Authors
Sabuj Mallik
Erica Hiu Laam Chan
Ndy Ekere
Publication date
01-04-2013
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 4/2013
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-012-0360-7

Other articles of this Issue 4/2013

Journal of Materials Engineering and Performance 4/2013 Go to the issue

OriginalPaper

Microstructure and Properties of Cast B-Bearing High Speed Steel

OriginalPaper

Effect of Host Media on Microbial Influenced Corrosion due to Desulfotomaculum nigrificans

OriginalPaper

Analysis of Bonding Behavior and Critical Reduction of Two-Layer Strips in Clad Cold Rolling Process

OriginalPaper

Two-Point Incremental Forming with Partial Die: Theory and Experimentation

OriginalPaper

Dual-Frequency Approach to Assess Surface Hardened Layer Using NDE Technology

OriginalPaper

Effect of Hydrogen and Magnetic Field on the Mechanical Behavior of High Strength AISI 4340 Steel

Premium Partners

    Image Credits