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Electrical Engineering
Published in: Electrical Engineering 3/2019

04-10-2019 | Original Paper

Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials

Authors: Enis Tuncer, Mohan Gupta, Daryl Heussner, Shawn O’Connor, Thu Tran

Published in: Electrical Engineering | Issue 3/2019

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Abstract

Isolation is required in electronic circuits to create zones for various voltage levels, where only low-voltage signals are allowed to communicate between zones. Application of such devices in circuits has challenges related to the anticipated working conditions at high voltages and its effect on design through employed materials, which need to provide the voltage isolation with good margin during the lifetime of the device. One of the technologies is provided with a capacitor-based isolators, which employ front- or back-end-of-the-line wafer-level dielectrics. Here, we propose a semiconductor packaging solution using a material, where a laminate buildup is characterized for high-voltage performance. The dielectric breakdown scaling for the material is reported for design considerations.
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Metadata
Title
Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials
Authors
Enis Tuncer
Mohan Gupta
Daryl Heussner
Shawn O’Connor
Thu Tran
Publication date
04-10-2019
Publisher
Springer Berlin Heidelberg
Published in
Electrical Engineering / Issue 3/2019
Print ISSN: 0948-7921
Electronic ISSN: 1432-0487
DOI
https://doi.org/10.1007/s00202-019-00840-7

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