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Electrical Engineering
Erschienen in: Electrical Engineering 3/2019

04.10.2019 | Original Paper

Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials

verfasst von: Enis Tuncer, Mohan Gupta, Daryl Heussner, Shawn O’Connor, Thu Tran

Erschienen in: Electrical Engineering | Ausgabe 3/2019

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Abstract

Isolation is required in electronic circuits to create zones for various voltage levels, where only low-voltage signals are allowed to communicate between zones. Application of such devices in circuits has challenges related to the anticipated working conditions at high voltages and its effect on design through employed materials, which need to provide the voltage isolation with good margin during the lifetime of the device. One of the technologies is provided with a capacitor-based isolators, which employ front- or back-end-of-the-line wafer-level dielectrics. Here, we propose a semiconductor packaging solution using a material, where a laminate buildup is characterized for high-voltage performance. The dielectric breakdown scaling for the material is reported for design considerations.
Vorheriger Artikel Dynamic behavior of multi-carrier energy market in view of investment incentives
Nächster Artikel A protection strategy for inverter-interfaced islanded microgrids with looped configuration

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Literatur
1.
Heidel ND, Usechak NG, Dohrman CL, Conway JA (2016) A review of electronic-photonic heterogeneous integration at DARPA. IEEE J Select Top Quant Electron 22(6):482CrossRef
2.
Or-Bach Z (2016) Monolithic 3D integration. Springer, Cham, pp 51–91
3.
Rahim K, Mian A (2017) A review on laser processing in electronic and MEMS packaging. J Electron Pack 139(3):030801CrossRef
4.
Seal S, Mantooth HA (2017) High performance silicon carbide power packaging–past trends, present practices, and future directions. Energies 10(3):341CrossRef
5.
Kumar A, Verma G, Nath V, Choudhury S, Packaging IC (2017) 3D IC technology and methods. Springer, Singapore, pp 303–317
6.
Sze SM (2008) Semiconductor devices: physics and technology. Wiley, New York
7.
Blalack T, Leclercq Y, Yue CP (2002) In: Proceedings of the bipolar/BiCMOS circuits and technology meeting. pp 205–211
8.
Thawani VK, Reghunathan A (2017) Fully integrated signal and power isolation—applications and benefits. SLYY112. Texas Instrument Incorporated, Dallas
9.
Bonifield T (2016) High-voltage isolation quality and reliability for amc130x. SSZY024. Texas Instruments Incorporated, Dallas
10.
Texas Instrument Incorporated, Dallas TX, Isolation Glossary, SLLA353 edn (2014)
11.
Kamath AS, Soundarapandian K (2014) High-voltage reinforced isolation: definitions and test methodologies. SLYY063. Texas Instrument Incorporated, Dallas
12.
Piipponen KVT, Sepponen R, Eskelinen P (2007) A biosignal instrumentation system using capacitive coupling for power and signal isolation. IEEE Trans Biomed Eng 54(10):1822–1828CrossRef
13.
Meinel W (1988) Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture. US Patent 4,780,795
14.
Somerville T (1989) Isolation amplifier with precise timing of signals coupled across isolation barrier. US Patent 4,835,486
15.
Scott J, Sooch N, Welland D (1999) Analog isolation system with digital communication across a capacitive barrier. US Patent 5,870,046
16.
Scott J, Sooch N, Welland D (2002) Capacitive isolation system with digital communication and power transfer. US Patent 6,430,229
17.
Krone A, Tuttle T, Scott J, Hein J, Dupuis T, Sooch N (2001) In: 2001 IEEE international solid-state circuits conference. Digest of technical papers. ISSCC (Cat. No.01CH37177), pp 300–301
18.
Perrin R, Allard B, Martin C, Buttay C (2016) In: CIPS 2016; 9th international conference on integrated power electronics systems, pp 1–4
19.
Kliger R (2003) Integrated transformer-coupled isolation. IEEE Instrum Meas Mag 6(1):16–19CrossRef
20.
Lynch L (1989) Printed wiring boards, vol 1, 5th edn. Electronic materials handbook. ASM International, Materials Park, pp 505–629
21.
Nakamura Y, Katogi S (2013) Technology trends and future history of semicondutor packaging substrate material. Technical Report No. 55, Hitachi Chemical
22.
Barnikas R (1983) In: Engineering dielectrics, vol. IIA, ed. by Barnikas/Eichhorn (ASTM)
23.
Meek JM, Craggs JD (1953) Electrical breakdown of gases. Oxford at the Clarendon Press, OxfordMATH
24.
Ushakov VY (2004) Insulation of high voltage equipment. Springer, BerlinCrossRef
25.
Weibull W (1939) A statistical theory of the strength of materials. No. 151 in Ingeniörsvetenskapsakademiens Handlingar. Generalstabens Litografiska anstalts förlag, Stockholm
26.
Weibull W (1951) A statistical distribution function of wide applicability. J Appl Mech 18(3):293–297MATH
27.
Tuncer E, Sauers I, James DR, Ellis AR, Pace MO (2006) On dielectric breakdown statistics. J Phys D Appl Phys 39:4257CrossRef
28.
Tuncer E, Polizos G, Sauers I, James DR, Ellis AR, More KL (2012) Epoxy nanodielectrics fabricated with in situ and ex situ techniques. J Exp Nanosci 7(3):274CrossRef
29.
Laihonen SJ, Gustafsson A, Gafvert U, Schutte T, Gedde UW (2007) Area dependence of breakdown strength of polymer films: automatic measurement method. IEEE Trans Dielectr Electric Insul 14(2):263CrossRef
30.
Laihonen SJ, Gafvert U, Schutte T, Gedde UW (2007) DC breakdown strength of polypropylene films: area dependence and statistical behavior. IEEE Trans Dielectr Electric Insul 14(2):275CrossRef
31.
Zhou R, Shah MR, Haran KS, Radun AV, Tuncer E (2015) Switched capacitive devices and method of operating such devices. US Patent Application 20150134109 A1
32.
Kearney DJ, Kicin S, Bianda E, Krivda A (2017) PCB embedded semiconductors for low-voltage power electronic applications. IEEE Trans Comp Pack Manuf Technol 7(3):387
33.
Shugg WT (1995) Handbook of electrical and electronic insulating materials, 2nd edn. IEEE Press, New YorkCrossRef
Metadaten
Titel
Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials
verfasst von
Enis Tuncer
Mohan Gupta
Daryl Heussner
Shawn O’Connor
Thu Tran
Publikationsdatum
04.10.2019
Verlag
Springer Berlin Heidelberg
Erschienen in
Electrical Engineering / Ausgabe 3/2019
Print ISSN: 0948-7921
Elektronische ISSN: 1432-0487
DOI
https://doi.org/10.1007/s00202-019-00840-7

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