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2011 | OriginalPaper | Chapter

14. Popcorn Cracking

Author : Rainer Dudek

Published in: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Publisher: Springer London

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Abstract

Interface delamination and popcorn cracking are among the most common reasons for mechanical damage in plastic packaging. Many investigations have shown the popcorn phenomenon to be a closely linked process of delamination of the pad/encapsulant interface, moisture diffusion, vapor pressure build-up, and popcorn cracking. A short survey on the phenomenon is given.

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previous chapter Excessive Warpage of Large Packages During Reflow Soldering

next chapter Thermal Capability of Components

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Title: Popcorn Cracking
Author: Rainer Dudek
Publisher: Springer London
Book: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Print ISBN: 978-0-85729-235-3

Electronic ISBN: 978-0-85729-236-0

Copyright Year: 2011
DOI: https://doi.org/10.1007/978-0-85729-236-0_14