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Nanopackaging: Nanotechnologies and Electronics Packaging Read chapter Read first chapter

2018 | OriginalPaper | Chapter

20. Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes

Authors : K. Mohan Kumar, Vaidyanathan Kripesh, Andrew A. O. Tay

Published in: Nanopackaging

Publisher: Springer International Publishing

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Abstract

Solders are extensively used in electronics packages as mechanical and electrical interconnects because of their ease of processing and low cost. Solder interconnects for wafer-level chip-scale packages are subject to high stresses caused by the mismatch in coefficient of thermal expansion between the silicon chip and the organic substrate when the packages experience changes in temperature during assembly, testing, and field operation. With the relentless trend toward ever-decreasing solder joint pitches and sizes, these thermomechanical stresses will increase exponentially, and there is a need to enhance the strength of the current solder materials to withstand the increased stresses. This chapter describes a study on the usage of single-walled carbon nanotubes (SWCNTs) as a reinforcing material for the enhancement of the solder material properties for use in wafer-level chip-scale packages. The aim of this work is to fabricate CNT-reinforced nanocomposite solders; characterize their improved physical, thermal, electrical, mechanical, and wetting properties; and compare them to the original Sn-Pb and Sn-Ag-Cu solders.

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previous chapter High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes
next chapter Nanowires in Electronics Packaging
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Metadata
Title
Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes
Authors
K. Mohan Kumar
Vaidyanathan Kripesh
Andrew A. O. Tay
Copyright Year
2018
Book
Nanopackaging

Print ISBN: 978-3-319-90361-3

Electronic ISBN: 978-3-319-90362-0

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-3-319-90362-0_20

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