Reactive wetting of Sn–2.5Ag–0.5Cu solder on copper and silver coated copper substrates

In the present work, wetting characteristics and morphology of intermetallic compounds (IMCs) formed between Sn–2.5Ag–0.5Cu lead-free solder on copper (Cu) and silver (Ag) coated copper substrates were compared. It was found that, Ag coated Cu substrate improved the wettability of solder alloy. The average values of contact angles of solder alloy solidified on Ag coated Cu substrate were reduced to about 50 % as compared to contact angles obtained on Cu substrates. Flow restrictivity for spreading of solder on Ag coated Cu was found to be lower as compared to Cu substrate. The spreading of solder alloy on Ag coated Cu exhibited halo zone. Coarse needle shaped Cu₆Sn₅ IMCs were observed at the solder/Cu substrate interface whereas at the solder/Ag coated Cu interface Cu₆Sn₅ IMCs showed scallop morphology. The formation of Cu₃Sn IMC was observed for the spreading of solder alloy on both substrates. The solder/Ag coated Cu substrate interface exhibited more particulates of Ag₃Sn precipitates as compared to solder/Cu substrate interface. The improved wettability of solder alloy on Ag coated Cu substrate is due to the formation of scallop IMCs at the interface.