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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 3/2017

17-10-2016

Role of substrate in electrodeposited copper telluride thin films

Authors: P. Jeyakumar, S. Thanikaikarasan, B. Natarajan

Published in: Journal of Materials Science: Materials in Electronics | Issue 3/2017

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Abstract

Copper telluride thin films have been prepared on different substrates using an electrodeposition technique. Stylus profilometry has been carried out to find out thickness value of the deposited films. X-ray diffraction analysis revealed that the prepared films possess polycrystalline in nature. Film composition with surface morphology has been analyzed using an energy dispersive analysis by X-rays and scanning electron microscopy. Optical absorption analysis showed that the prepared films possess band gap value in the range between 2.02 and 2.26 eV. Value of refractive index, extinction coefficient, real and imaginary dielectric constants are estimated for films obtained on transparent substrates.
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Footnotes
1
File No. 39, 1061 (Joined Council for Powder Diffracted Systems International Centre for Diffraction Data, Pennsylvania, USA, 2003).
 
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Metadata
Title
Role of substrate in electrodeposited copper telluride thin films
Authors
P. Jeyakumar
S. Thanikaikarasan
B. Natarajan
Publication date
17-10-2016
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 3/2017
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-5828-z

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