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Wireless Personal Communications

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12-10-2016

Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards

Authors: Muthuramalingam Sindhadevi, Kanagasabai Malathi, Arun Henridass, Arun Kumar Shrivastav

Published in: Wireless Personal Communications | Issue 4/2017

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Abstract

In this article, the Signal Integrity performance analysis of mutual coupling reduction with defective ground structures (DGS) in high speed PCBs has been investigated. The performances of these structures are analyzed, in terms of Time domain, Error Vector Magnitude (EVM), eye pattern and timing jitter. A NRZ test signal with Quadrature Phase Shift keying modulation, with a carrier frequency of 3.5 GHz is used for the EVM measurements. From the EVM measurements, it is observed that the PCB with Circular DGS has the lowest EVM of 1.195 % rms compared to other techniques. Further, the eye pattern and jitter analysis show that the circular DGS has the lowest jitter value of 8 ps at 1Gbps data rate. Finally, the electromagnetic compatibility of proposed method is checked with the surface current distribution and radiated emission analysis. These investigations show that the adoption of the circular DGS in the high speed PCB design, reduces the spacing between two traces without degrading the signal quality.

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Title: Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards
Authors: Muthuramalingam Sindhadevi
Kanagasabai Malathi
Arun Henridass
Arun Kumar Shrivastav
Publication date: 12-10-2016
Publisher: Springer US
Published in: Wireless Personal Communications / Issue 4/2017
Print ISSN: 0929-6212
Electronic ISSN: 1572-834X
DOI: https://doi.org/10.1007/s11277-016-3774-y

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