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Wireless Personal Communications
Erschienen in: Wireless Personal Communications 4/2017

12.10.2016

Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards

verfasst von: Muthuramalingam Sindhadevi, Kanagasabai Malathi, Arun Henridass, Arun Kumar Shrivastav

Erschienen in: Wireless Personal Communications | Ausgabe 4/2017

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Abstract

In this article, the Signal Integrity performance analysis of mutual coupling reduction with defective ground structures (DGS) in high speed PCBs has been investigated. The performances of these structures are analyzed, in terms of Time domain, Error Vector Magnitude (EVM), eye pattern and timing jitter. A NRZ test signal with Quadrature Phase Shift keying modulation, with a carrier frequency of 3.5 GHz is used for the EVM measurements. From the EVM measurements, it is observed that the PCB with Circular DGS has the lowest EVM of 1.195 % rms compared to other techniques. Further, the eye pattern and jitter analysis show that the circular DGS has the lowest jitter value of 8 ps at 1Gbps data rate. Finally, the electromagnetic compatibility of proposed method is checked with the surface current distribution and radiated emission analysis. These investigations show that the adoption of the circular DGS in the high speed PCB design, reduces the spacing between two traces without degrading the signal quality.
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Metadaten
Titel
Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards
verfasst von
Muthuramalingam Sindhadevi
Kanagasabai Malathi
Arun Henridass
Arun Kumar Shrivastav
Publikationsdatum
12.10.2016
Verlag
Springer US
Erschienen in
Wireless Personal Communications / Ausgabe 4/2017
Print ISSN: 0929-6212
Elektronische ISSN: 1572-834X
DOI
https://doi.org/10.1007/s11277-016-3774-y

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