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Metallurgical and Materials Transactions A
Published in: Metallurgical and Materials Transactions A 4/2019

11-01-2019

Significance of Interface Design Aspects and Characteristics in Cu/SiCp Composites Fabricated by the Powder Metallurgy Route

Authors: T. S. Kavithaa, L. Rangaraj, S. S. Avadhani

Published in: Metallurgical and Materials Transactions A | Issue 4/2019

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Abstract

The research focuses on the interfacial design characteristics of Cu/SiCp composites by the provision of a metallic (NiP2) and a ceramic oxide (Y2O3) coating on SiCp for achieving better barrier or wetting properties. The research work further aims at the optimization of the powder metallurgy (PM) process parameters for compaction of interface-tailored Cu/SiCp composites. The microstructural and thermal property evaluation of the developed Cu/SiCp composite systems is described. The research evidences the best achievable thermal properties of developed Cu/SiCp composites and emphasizes the possible feasibility of establishing a materials development strategy toward their successful implementation as a novel thermal management material for aerospace electronic packages.
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Metadata
Title
Significance of Interface Design Aspects and Characteristics in Cu/SiCp Composites Fabricated by the Powder Metallurgy Route
Authors
T. S. Kavithaa
L. Rangaraj
S. S. Avadhani
Publication date
11-01-2019
Publisher
Springer US
Published in
Metallurgical and Materials Transactions A / Issue 4/2019
Print ISSN: 1073-5623
Electronic ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-018-5089-y

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