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Published in:
Why Are Silicon Wafers as Thick as They Are? Read chapter Read first chapter

2011 | OriginalPaper | Chapter

18. Structure Impaired Mechanical Stability of Ultra-thin Chips

Authors : Tu Hoang, Stefan Endler, Christine Harendt

Published in: Ultra-thin Chip Technology and Applications

Publisher: Springer New York

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Abstract

Flexibility of ultra-thin chips is an important condition for applications in flexible electronics. Especially, mechanical reliability of ultra-thin chips is a key factor generally determining the final performance and reliability of a flexible electronics product. Structures and designs implemented on the chips are the elements that weaken the mechanical stability of the final product. In this chapter the excellent mechanical strength of 20-μm thin silicon chips produced by the ChipfilmTM technology is discussed. The influences of different parameters, such as the number of anchors per chip edge, the backside porous silicon and the topography formed by CMOS integration, on their mechanical reliability are investigated by means of uniaxial bending tests. The experimental results are statistically evaluated by the Weibull theory, in which the resulting failure stress data are used to obtain the fracture strength and estimate failure origins of the tested ultra-thin chips.

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previous chapter Mechanical Characterisation and Modelling of Thin Chips
next chapter Piezoresistive Effect in MOSFETS
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Metadata
Title
Structure Impaired Mechanical Stability of Ultra-thin Chips
Authors
Tu Hoang
Stefan Endler
Christine Harendt
Copyright Year
2011
Publisher
Springer New York
Book
Ultra-thin Chip Technology and Applications

Print ISBN: 978-1-4419-7275-0

Electronic ISBN: 978-1-4419-7276-7

Copyright Year: 2011

DOI
https://doi.org/10.1007/978-1-4419-7276-7_18