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Journal of Electronic Materials
Published in: Journal of Electronic Materials 9/2004

01-09-2004 | Regular Issue Paper

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Authors: Minna Arra, Dongkai Shangguan, Dongji Xie, Janne Sundelin, Toivo Lepistö, Eero Ristolainen

Published in: Journal of Electronic Materials | Issue 9/2004

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previous article Mesa-size dependence characteristics of vertical surface-emitting lasers
next article Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

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Metadata
Title
Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications
Authors
Minna Arra
Dongkai Shangguan
Dongji Xie
Janne Sundelin
Toivo Lepistö
Eero Ristolainen
Publication date
01-09-2004
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 9/2004
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-004-0025-x

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High-resistivity GaSb bulk crystals grown by the vertical bridgman method

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Characterization and modeling of static and cyclic relaxation in nonconductive adhesives

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The electrical properties and stability of the hafnium silicate/Si0.8Ge0.2(100) interface